Information
11
Commitment to the Relentless Quest for Perfection
Quality and Reliability
AUTOMOTIVE PRODUCTS GROUP
8-D REPORT
DATE: August 28, 2007
SUBJECT: defect VIA
REVISION: A
FA #: C070816
MICROCHIP P/N: 24LC16B
Trace Code: 06443WV
MASK NO.: C5AR3
CUSTOMER: TRW
Customer Part #: 59141550
Customer Tracking Number: 204115
1. USE TEAM APPROACH:
Andy Birrell - Yield Enhancement Engineering Manager
Roger Melcher - Wafer Manufacturing Engineer
Anupam Menghal - APG Quality Engineer
Craig Comeaux - Failure Analysis Engineer
Steve Vernier - APG Product Engineer
2. DESCRIBE PROBLEM:
One 24LC16B device was returned when the customer reported that device is
failed in end user applications. The device failure has been confirmed during
bench testing as well as ATE testing. All the pins appeared normal during initial
curve tracing. Bench testing revealed that the device was drawing abnormally
high current. It is also confirmed that the multiple addresses in array are flipping
with each read. The ATE testing also revealed that the returned unit may have
failed the parametric or functional tests.
Part Submission Warrant
Part Name Cust. Part Number
Shown on Drawing Number Orig. Part Number
Engineering Change Level Dated
Additional Engineering Changes
N/A Dated
Safety and/or Government Regulation Purchase Order No.
N/A
Checking Aid Number Checking Aid Eng. Change Level Dated
ORGANIZATION MANUFACTURING INFORMATION CUSTOMER SUBMITTAL INFORMATION
Organization Name & Supplier/Vendor Code Customer Name/Division
Street Address Buyer/Buyer Cod
e
USA
City Region Postal Code Country Application
MATERIALS REPORTING
Has customer-required Substances of Concern information been reported?
Submitted by IMDS or other customer format:
Are polymeric parts identified with appropriate ISO marking codes?
REASON FOR SUBMISSION (Check at least one)
Initial submission Change to Optional Construction or Material
Engineering Change(s) Sub-Supplier or Material Source Change
Tooling: Transfer, Replacement, Refurbishment, or additional Change in Part Processing
Correction of Discrepancy Parts produced at Additional Location
Tooling Inactive > than 1 year Other - please specify
REQUESTED SUBMISSION LEVEL (Check one)
Level 1 - Warrant only (and for designated appearance items, an Appearance Approval Report) submitted to customer.
Level 2 - Warrant with product samples and limited supporting data submitted to customer.
Level 3 - Warrant with product samples and complete supporting data submitted to customer.
Level 4 - Warrant and other requirements as defined by customer.
Level 5 - Warrant with product samples and complete supporting data reviewed at organization's manufacturing location.
SUBMISSION RESULTS
The results for
These results meet all design record requirements: (If "NO" - Explanation Required)
Mold / Cavity / Production Process
N/A
DECLARATION
EXPLANATION/COMMENTS:
Is each Customer Tool properly tagged and numbered?
Organization Authorized Signature Date
Print Name
Title Corporate Quality E-mail
FOR CUSTOMER USE ONLY (IF APPLICABLE)
PPAP Warrant Disposition:
Customer Signature Date
Print Name Customer Tracking Number (optional)
N/A
N/A
Weight (kg)
Pb-Free N/A N/A
I affirm that the samples represented by this warrant are representative of our parts, which were made by a process that meets all Production
Part Approval Process Manual 4th Edition Requirements. I further affirm that these samples were produced at the production rate of
_N/A
___/_N/A___ hours. I also certify that documented evidence of such compliance is on file and available for your review. I have noted any
deviation from this declaration below.
Chandler Arizona 85224
2355 W Chandler Blvd.
Microchip Technology Inc.
Phone No. Fax No.
Node ID#
PPAP#
480-792-4317
Yes NO
dimensional measurements material and functional tests appearance criteria statistical process package
Yes No
Yes No
Yes No
Approved Rejected
Other
n/a
n/a
Yes No n/a
N/
A
d
uction
rate o
f
t
ed an
y
age
AEC - Q100 - Rev-G
May 14, 2007
FAILURE MECHANISM BASED
STRESS TEST QUALIFICATION
FOR
INTEGRATED CIRCUITS
Component Technical Committee
Automotive Electronics Council
“Quality Comes First” is at the top of the list of Guiding
Values for Microchip Technology. As an ISO/TS-16949
certified supplier since 2003, Microchip’s Aggregate
System uniquely supports our commitment to
exceptional quality. In an environment where enterprise
wide commitment to continuous improvement is
demonstrated and every employee is responsible for
quality.
With nearly 20 years of experience in serving the demanding requirements of the automotive customer, Microchip
Technology has a proven track record of success in delivering the total product solution to our valued customers that
is cost effective and reliable.
Corporate Headquarters
Chandler, Arizona
C
t
H
d
t
Fab 2
Tempe, Arizona
Fab 4
Gresham, Oregon
Product Assembly/Test
Bangkok, Thailand
www.microchip.com/quality
Microchip supports various automotive quality
initiatives:
Zero Defect Initiatives
APQP – Advanced Product/Process Quality Planning
AEC-Q100 Stress Testing
PPAP – Production Part Approval Process
8D Reporting
Product Change Notification