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MCP2210 EVALUATION KIT

USER’S GUIDE

Appendix B. Bill of Materials

TABLE B-1: BILL OF MATERIALS - MCP2210 BREAKOUT BOARD

Qty Reference Description_ Manufacturer Part Number

1 C1 Cap. Cer. 22 uF 10V 20% Y5V 1206 TDK

Corporation

C3216Y5V1A226Z

3 C2, C4, C5 Cap. Cer. 1 uF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A

1 C3 Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K

1 C6 Cap. Cer. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K

2J1, J2 DO NOT POPULATE

Conn. Hdr. Male .100 1x7 POS Vert.

TE Connectivity Ltd. HDR M 1x7 Vertical

1J3 DO NOT POPULATE

Conn. Hdr. Male .100 1x6 POS Vert.

TE Connectivity Ltd. HDR M 1x6 Vertical

1J4 DO NOT POPULATE

Conn. Hdr. Male .100 1x3 POS Vert.

TE Connectivity Ltd. HDR M 1x3 Vertical

1 J5 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co. Ltd. UX60SC-MB-5ST(80)

1 PCB RoHS compliant bare PCB, MCP2210

Breakout Board

— 104-00419

1 R1 Res. 390 Ohm 1/10W 5% 0603 SMD Panasonic

- ECG ERJ-3GEYJ391V

1 U1 IC USB-TO-SPI SSOP-20 Microchip Technology

Inc.

MCP2210-I/SS

1 U2 IC LDO Reg. 500 mA 3.3V SOT-223-3 Microchip Technology

Inc.

MCP1825S-3302E/DB

1 X1 Cer. Resonator 12.0 MHz SMD Murata Electronics

CSTCE12M0G55-R0

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

TABLE B-2: BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD

Qty Reference Description_ Manufacturer Part Number

5 C1, C2, C3,

C4, C6

Cap. Cer. 0.1 uF 50V X7R 10% 0603 TDK Corporation C1608X7R1H104K

2 C5, C7 Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K

19 J1, J2, J3, J4,

J5, J6, J7, J8,

J9, J14, J15,

J16, J17, J18,

J19, J20, J21,

J22, J23

PC test point Tin SMD Harwin Plc. S1751-46R

1 J10 Conn. Hdr. Male .100 1x6 Pos. RA TE Connectivity Ltd. HDR M 1x6 RA

2 J11, J13 Conn. Hdr. Male .100 1x7 Pos. Vert. TE Connectivity Ltd. HDR M 1x7 Vertical

1 J12 Conn. Hdr. Male .100 2x8 Pos. Vert. TE Connectivity Ltd. HDR M 2x8 Vertical

1 L1 Ferrite Chip 47 Ohms 500 mA 0603 Laird Technologies

LI0603E470R-10

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.