User manual

MCP2210 BREAKOUT MODULE
USER’S GUIDE
© 2012 Microchip Technology Inc. DS52056A-page 25
Appendix B. Bill of Materials
TABLE B-1: BILL OF MATERIALS
Qty Designator Description_ Manufacturer 1 Part Number
1 C1 Cap. Cerm. 22 uF 10V 20% Y5V 1206 TDK
®
Corporation C3216Y5V1A226Z
3 C2, C4, C5 Cap. Cerm .1 uF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A
1 C3 Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K
1 C6 Cap. Cerm. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K
2J1, J2 DO NOT POPULATE
Conn. Hdr. Male .100 1x7 Pos. Vertical
Tyco
®
Electronics HDR M 1x7 Vertical
1J3 DO NOT POPULATE
Conn. Hdr. Male .100 1x6 Pos. Vertical
Tyco Electronics HDR M 1x6 Vertical
1J4 DO NOT POPULATE
Conn. Hdr. Male .100 1x3 Pos. Vertical
Tyco Electronics HDR M 1x3 Vertical
1 J5 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co. Ltd. UX60SC-MB-5ST(80)
1 R1 Res. 390 Ohm 1/10W 5% 0603 SMD Panasonic
®
- ECG ERJ-3GEYJ391V
1 U1 IC USB-TO-SPI SSOP-20 Microchip Technology
Inc.
MCP2210-I/SS
1 U2 IC LDO Reg. 500 mA 3.3V SOT-223-3 Microchip Technology
Inc.
MCP1825S-3302E/DB
1 X1 Cer. Resonator 12.0 MHz SMD Murata Electronics
®
CSTCE12M0G55-R0
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.