MCP2210 Breakout Module User’s Guide © 2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
MCP2210 BREAKOUT MODULE USER’S GUIDE Table of Contents Preface ........................................................................................................................... 5 Introduction............................................................................................................ 5 Document Layout .................................................................................................. 5 Conventions Used in this Guide ....................................................
MCP2210 Breakout Module User’s Guide DS52056A-page 4 © 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number.
MCP2210 Breakout Module User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...
Preface RECOMMENDED READING This user's guide describes how to use MCP2210 Breakout Module. Other useful documents are listed below. The following Microchip document is available and recommended as a supplemental reference resource. • MCP2210 Data Sheet - “USB-to-SPI Protocol Converter with GPIO (Master Mode)” (DS22288) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
MCP2210 Breakout Module User’s Guide NOTES: DS52056A-page 8 © 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP2210 Breakout Module and covers the following topics: • MCP2210 Breakout Module General Description • What the MCP2210 Breakout Module Kit Includes 1.2 MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION The MCP2210 Breakout Module is a development and evaluation platform for the MCP2210 device. The module is comprised of a single DIP form-factor board.
MCP2210 Breakout Module User’s Guide NOTES: DS52056A-page 10 © 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION The MCP2210 Breakout Module is designed to demonstrate the device as a USB-to-SPI (Master) bridge solution. The package is comprised of a single board and has the following features: • Small plug-in board with DIP form factor (600 millimeters overall row spacing between pins) • Mini-USB connector • Access to SPI bus and all GP signals through USB port • PICkit™ Serial Analyzer compatible header • 3.
MCP2210 Breakout Module User’s Guide 2.3 BOARD OPERATION The MCP2210 will be detected by a Windows PC host as an HID device. The accompanying software can be used to exercise the MCP2210 Breakout Module’s features and also provides a reference point for users that want to design their own applications based on the MCP2210 device. 2.3.1 MCP2210 Breakout Board Operation The MCP2210 Breakout Module can be used as a stand-alone USB-to-SPI (Master) bridge module.
Installation and Operation FIGURE 2-1: SPI TERMINAL UTILITY WINDOW SPI user data section GP Settings Section HEX/Decimal user data mode SPI Transfer Parameters Section Status messages Transfer Data button GP Direct Settings section After the application is started, the state of the connection with the MCP2210 is shown in the Status Messages section (lower left corner of the screen). The user can establish the GP configuration. The GPs can be used as chip select pins.
MCP2210 Breakout Module User’s Guide A wider range of tests is available when using this board and the utility software with the MCP2210 Evaluation Kit (ADM00421). This kit allows communication with several SPI slave devices (I/O expander, EEPROM, ADC and temperature sensor). For more details on examples using the SPI Terminal Utility software, see MCP2210 Evaluation Kit User’s Guide (DS52057). 2.4 MCP2210 TYPICAL USAGE SCENARIOS MCP2210 can be used in systems where an SPI bus is available.
Installation and Operation When GP8 is configured for its dedicated functionality, the pin can be used as a bus release request for MCP2210 coming from another master. GP7 (configured for its dedicated functionality) is used as an SPI bus release acknowledge signal towards the requesting master.
MCP2210 Breakout Module User’s Guide DS52056A-page 16 © 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP2210 Breakout Module: • • • • • • • Board – Schematic Board – Top Silk and Pads Board – Top Silk, Pads and Copper Board – Top Pads and Copper Board – Bottom Silk and Pads Board – Bottom Silk, Pads and Copper Board – Bottom Pads and Copper © 2012 Microchip Technology Inc.
J1 7 6 5 4 3 2 1 U2 MCP1825S-3.3V 1 3 VIN VOUT GP0 GP1 GP2 GP3 GP4 MOSI SCK GND D 2 GND HDR M 1x7 VERT Left Side Header 0.1uF 0603 C4 GND D GND D 4.7uF 0603 C3 5V VDD GND D 0.1uF 0603 C5 GND D J3 GND D VDD J2 HDR M 1x7 VERT Right Side Header GP8 GP7 GP6 GP5 MI SO GND D 5V 22uF 1206 C1 Default connection between 1 - 2. User to cut the trace if 5V VDD is needed. PICkit™ Serial Analyzer Header HDR M 1x6 VERT J4 1 2 3 VDD HDR M 1x3 VERT NT1 3.
Schematic and Layouts A.3 BOARD – TOP SILK AND PADS © 2012 Microchip Technology Inc.
MCP2210 Breakout Module User’s Guide A.4 BOARD – TOP SILK, PADS AND COPPER DS52056A-page 20 © 2012 Microchip Technology Inc.
Schematic and Layouts A.5 BOARD – TOP PADS AND COPPER © 2012 Microchip Technology Inc.
MCP2210 Breakout Module User’s Guide A.6 BOARD – BOTTOM SILK AND PADS DS52056A-page 22 © 2012 Microchip Technology Inc.
Schematic and Layouts A.7 BOARD – BOTTOM SILK, PADS AND COPPER © 2012 Microchip Technology Inc.
MCP2210 Breakout Module User’s Guide A.8 BOARD – BOTTOM PADS AND COPPER DS52056A-page 24 © 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE USER’S GUIDE Appendix B. Bill of Materials TABLE B-1: Qty BILL OF MATERIALS Designator Description_ Manufacturer 1 Part Number 1 C1 Cap. Cerm. 22 uF 10V 20% Y5V 1206 TDK® 3 C2, C4, C5 Cap. Cerm .1 uF 10% 16V X7R 0603 AVX Corporation 1 C3 Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K 1 C6 Cap. Cerm. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K 2 J1, J2 DO NOT POPULATE Conn. Hdr. Male .100 1x7 Pos.
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