User manual

MCP2200 BREAKOUT MODULE
USER’S GUIDE
 2012 Microchip Technology Inc. DS52064A-page 3
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What Is the MCP2200 Breakout Module? ...................................................... 9
1.3 What the MCP2200 Breakout Module Kit Contains ....................................... 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2200 Typical Usage Scenarios ............................................................. 13
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 15
A.2 Board – Schematic ....................................................................................... 16
A.3 Board – Top Silk .......................................................................................... 17
A.4 Board – Top Silk and Pads .......................................................................... 18
A.5 Board – Top Copper .................................................................................... 19
A.6 Board – Bottom Silk ..................................................................................... 20
A.7 Board – Bottom Silk and Pads ..................................................................... 21
A.8 Board – Bottom Copper ............................................................................... 22
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service ....................................................................................24