User manual

MCP2200 BREAKOUT
MODULE USER’S GUIDE
 2012 Microchip Technology Inc. DS52064A-page 23
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS
Qty. Designator Description Manufacturer Part Number
1 C1 Cap. Ceramic 4.7uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K
3 C2, C3, C4 Cap. Ceramic 1UF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A
1 C5 Cap. Ceramic 0.1uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C104K
1 J1 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co., Ltd. UX60SC-MB-5ST(80)
1 J2 Conn. Hdr. Male .100 1x3 POS Vert. TE Connectivity HDR M 1x3 Vertical
2J3, J4 DO NOT POPULATE
Conn. Hdr. Male .100 1x7 POS Vert.
TE Connectivity HDR M 1x7 Vertical
1J5 DO NOT POPULATE
Conn. Hdr. Male .100 1x6 POS Vert.
TE Connectivity HDR M 1x6 Vertical
1 JP1 Conn. Jumper with Handle 2 POS .100"
30 GOLD
TE Connectivity 881545-2
1 PCB MCP2200 Breakout Module Printed
Circuit Board
— 104-00393
1 R1 Res. 4.7k Ohm 1/10W 5% 0603 SMD Panasonic
®
- ECG ERJ-3GEYJ472V
1 U1 IC USB-to-UART SSOP-20 Microchip Technology Inc. MCP2200-I/SS
1 U2 IC Reg. LDO 3.3V 250 mA SOT-23-3 Microchip Technology Inc. MCP1700T-3302E/TT
1 X1 Ceramic Resonator 12.0 MHz SMD Murata Electronics
®
CSTCE12M0G55-R0
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.