MCP2200 Breakout Module User’s Guide 2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
MCP2200 BREAKOUT MODULE USER’S GUIDE Table of Contents Preface ........................................................................................................................... 5 Introduction............................................................................................................ 5 Document Layout .................................................................................................. 5 Conventions Used in this Guide ....................................................
2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number.
MCP2200 Breakout Module User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...
Preface RECOMMENDED READING This user's guide describes how to use the MCP2200 Breakout Module. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource. • MCP2200 Data Sheet - “USB 2.0 to UART Protocol Converter with GPIO” (DS22228) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
MCP2200 Breakout Module User’s Guide NOTES: DS52064A-page 8 2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP2200 Breakout Module and covers the following topics: • What Is the MCP2200 Breakout Module? • What the MCP2200 Breakout Module Kit Contains 1.2 WHAT IS THE MCP2200 BREAKOUT MODULE? The MCP2200 Breakout Module is a development and evaluation platform for the USB-to-UART (Universal Serial Bus-to-Universal Asynchronous Receiver/Transmitter) serial converter MCP2200 device.
MCP2200 Breakout Module User’s Guide NOTES: DS52064A-page 10 2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION The MCP2200 Breakout Module is designed to demonstrate the device as an USB-to-UART protocol converter solution. The module is comprised of a single board and has the following features: • Small plug-in board with DIP form factor (0.6 inches overall row spacing between pins) • Mini-USB connector • Access to the UART signals (Tx, Rx, RTS and CTS) and all GP signals • PICkit™ Serial Analyzer compatible header • 3.
MCP2200 Breakout Module User’s Guide FIGURE 2-1: 2.3 BREAKOUT BOARD LAYOUT BOARD OPERATION The MCP2200 device is detected by a Windows®-based PC host as a composite device. The accompanying software can be used to exercise the board’s features and also provides a reference point for users that want to design their own applications based on the MCP2200 device. 2.3.1 MCP2200 Breakout Module Operation The MCP2200 Breakout Module can be used with a UART-based system.
Installation and Operation 2.4 MCP2200 TYPICAL USAGE SCENARIOS MCP2200 can be used in systems where a UART bus is available. The MCP2200 enables the USB connection to a UART-based system. FIGURE 2-2: MCP2200 TYPICAL USAGE DIAGRAM MCP2200 Breakout Board MCP2200 2012 Microchip Technology Inc.
MCP2200 Breakout Module User’s Guide NOTES: DS52064A-page 14 2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP2200 Breakout Module: • • • • • • • Board – Schematic Board – Top Silk Board – Top Silk and Pads Board – Top Copper Board – Bottom Silk Board – Bottom Silk and Pads Board – Bottom Copper 2012 Microchip Technology Inc.
BOARD – SCHEMATIC 5V J1 VDD 1 R1 4.7k 1 2 3 1 C3 0.1uF 10% 0603 GND 1 3 C5 0.1uF 0603 5 3 GND GND J3 D+ ID GND GND 2 HDR M 1x3 VERT D- USB-B-Mini SMD GND D VDD J2 7 6 5 4 3 2 1 GND 5V GND D C2 0.1uF 10% 0603 VOUT X1 12MHz USB_P GND GND GP7 GP6 GP5 GP4 GP3 TX RX 1 2 3 4 5 6 7 8 9 10 VDD VSS OSC1 D+ OSC2 DRST VUSB GP7/TxL ED GP0 GP6/RxL ED GP1 GP5 GP2 GP4 CTS GP3 RX TX RTS 20 19 18 17 16 15 14 13 12 11 GND VDD USB_P USB_N VUSB J4 C4 0603 0.
Schematic and Layouts A.3 BOARD – TOP SILK 2012 Microchip Technology Inc.
MCP2200 Breakout Module User’s Guide A.4 BOARD – TOP SILK AND PADS DS52064A-page 18 2012 Microchip Technology Inc.
Schematic and Layouts A.5 BOARD – TOP COPPER 2012 Microchip Technology Inc.
MCP2200 Breakout Module User’s Guide A.6 BOARD – BOTTOM SILK DS52064A-page 20 2012 Microchip Technology Inc.
Schematic and Layouts A.7 BOARD – BOTTOM SILK AND PADS 2012 Microchip Technology Inc.
MCP2200 Breakout Module User’s Guide A.8 BOARD – BOTTOM COPPER DS52064A-page 22 2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty. BILL OF MATERIALS Designator Description Manufacturer Part Number 1 C1 Cap. Ceramic 4.7uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K 3 C2, C3, C4 Cap. Ceramic 1UF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A 1 C5 Cap. Ceramic 0.1uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C104K 1 J1 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co., Ltd. UX60SC-MB-5ST(80) 1 J2 Conn. Hdr. Male .
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