User manual

MCP16301 300 mA D
2
PAK
DEMO BOARD USER’S GUIDE
© 2011 Microchip Technology Inc. DS51983A-page 3
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 MCP16301 Short Overview ............................................................................ 9
1.3 What is the MCP16301 300 mA D
2
PAK Demo Board? ............................... 10
1.4 What Does the MCP16301 300 mA D
2
PAK Demo Board Kit Contain? ....... 10
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Getting Started ............................................................................................. 12
Appendix A. Schematics and Layouts
A.1 Introduction .................................................................................................. 13
A.2 Board – Schematic ....................................................................................... 14
A.3 Board – Top Silk and Pads .......................................................................... 15
A.4 Board – Top Copper Layer .......................................................................... 15
A.5 Board – Bottom Copper Layer ..................................................................... 16
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 18