User manual

 2014 Microchip Technology Inc. DS50002243A-page 35
EEP and Emulation Header
User’s Guide
Chapter 4. Emulation Header Target Footprints
4.1 INTRODUCTION
To connect a debug header directly to a target board (without the use of a transition
socket) the following information will be helpful.
• DIP Device Footprints
• TQFP/PLCC Device Footprints
4.2 DIP DEVICE FOOTPRINTS
DIP device adapter footprints shown will accept adapter plugs like Samtec series APA
plugs. These plugs can be soldered into place during development/emulation and
eliminate the need for any other sockets.
FIGURE 4-1: DIP FOOTPRINT
4.3 TQFP/PLCC DEVICE FOOTPRINTS
TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec
series DWM 0.050 Pitch Stackers. These stackers can be soldered into place during
development/emulation and eliminate the need for any other sockets.
FIGURE 4-2: SINGLE-ROW TQFP/PLCC FOOTPRINT
0.100
C
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of DIP is 40-pin.
DIP C
8-Pin 0.300
14-Pin 0.300
18-Pin 0.300
20-Pin 0.300
28-Pin 0.300
40-Pin 0.600
0.028 DIA
PLATED-THRU
HOLES
0.050
0.800
0.800
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
0.028 DIA
PLATED-THRU
HOLES