Datasheet

Emulator User’s Guide for MPLAB X IDE
DS52085A-page 30  2013 Microchip Technology Inc.
FIGURE 3-3: STANDARD CONNECTION – ICE DEVICE
3.4.2 High-Speed/LVDS Communication (Performance Pak)
The emulator system can be configured to use the high-speed/LVDS connection for
communicating debug and programming instructions to the target. Compared to
standard communication, this form of communication provides the following features.
• Noise cancellation from the low-voltage differential signal (LVDS) technology,
which allows:
- Data rates greater than 15 MIPS for data capture, runtime watches,and
Native trace.
- Longer distances between the emulator and the target.
- Operation in noisy environments.
• Two additional pins used for SPI trace.
The high-speed driver board (from the Performance Pak) is plugged into the emulator
pod to configure the system for this type of communication with the target. The modular
cables can be inserted into matching connectors at the high-speed receiver board. The
high-speed receiver board is attached via an 8-pin connector into either (1) the target
board, with an on-board target device as shown in Figure 3-4, or (2) the debug header
(from the Processor Pak), which is then plugged into the target board (Figure 3-5).
If your application is high-voltage, you will also need to replace the high-speed receiver
board with an A/C isolator unit to isolate the target. See Section 13.4 “MPLAB REAL
ICE Isolator Unit (Opto-Isolator)”.
For more on the hardware, see Section 13.3 “High-Speed/LVDS Communication
Hardware (Performance Pak)”.
Emulator Pod
Target Board
Transition Socket
ACTIVE
STATUS
RESETFUNCTION
Device-ICE
Processor Pak
Standard
Adapter
Header
Standard
Driver Board
Modular
Cable