User manual

Hardware Specification
© 2006 Microchip Technology Inc. DS51616A-page 45
7.7 HIGH-SPEED COMMUNICATION BOARDS
For high-speed emulator communication with a target (Section 2.4.2 “High-Speed
Communication”), use the following boards:
High-Speed Driver Board
High-Speed Receiver Board
7.7.1 High-Speed Driver Board
The high-speed driver board consists of two separate multipoint LVDS (Low Voltage
Differential Signal) transmitters and receivers for clock and data. Multipoint LVDS
requires 100 ohm terminations at each driver output and receiver input, per the
standard, and multipoint configurations type 2 receivers are used, as these are
intended for control signals or where fail-safe provisions are needed. Even though the
standard allows for any combination of drivers, receivers and/or transceivers of up to
32 on the line, only two will be used. The driver board has a port expansion which is
controlled by an I
2
C™ interface for sending and receiving status information to the
emulator. The high-speed driver board assembly is inserted into the emulator pod via
the card guide.
FIGURE 7-3: DUAL 8-PIN PINOUT
Note: Data rates up to 40 MIPS are possible.
2
1
4
3
6
5
Bottom of
Receiver Board
2
1
4
3
6
5
J3
J2
J3 Pinout
* future feature
J2 Pinout
Pin Name Function Pin Name Function
1 DATAEN+ Std Data Enable + 5 USPID– *Serial Data –
2 DATAEN– Std Data Enable – 6 CLKEN– Std Clock Enable –
3 CLKEN+ Std Clock Enable + 7 USPIC+ *Serial Clock +
4 USPID+ *Serial Data + 8 USPIC– *Serial Clock –
Pin Name Function Pin Name Function
1 LVC+ LV Std Data + 5 GND Ground
2 LVD– LV Std Data – 6 LVC– LV Std Clock –
3 LVC+ LV Std Clock + 7 Vdd_TGT Vdd on target
4 Vdd Power 8 Vpp_TGT Vpp on target
8
7
8
7