User manual

MPLAB
®
REAL ICE
™
In-Circuit Emulator User’s Guide
DS51616B-page 16 © 2008 Microchip Technology Inc.
2.3.2 High-Speed Communication
The emulator system can be configured to use high-speed communication for both
programming and debugging functions. This connection allows for higher speed
operations, a longer distance between the emulator and target, and additional tracing
functionality over a standard connection.
The high-speed driver board (from the Performance Pak) is plugged into the emulator
pod to configure the system for this type of communication with the target. The modular
cables can be inserted into matching sockets at the high-speed receiver board, which
is attached via an 8-pin connector into either (1) the target board, with an on-board
target device (Figure 2-4), or (2) the header board (from the Processor Pak), which in
then plugged into the target board (Figure 2-5).
For more on high-speed communication, see Chapter 12. “Hardware Specification”.
FIGURE 2-4: HIGH-SPEED EMULATOR SYSTEM – DEVICE WITH
ON-BOARD ICE CIRCUITRY
FIGURE 2-5: HIGH-SPEED EMULATOR SYSTEM – ICE DEVICE
Emulator Pod
Target Board
High-Speed
Driver Board
Target Device
ACTIVE
STATUS
RESETFUNCTION
J2
J3
High-Speed
Receiver Board
J2
J3
Performance Pak
or PIM
Emulator Pod
ACTIVE
STATUS
RESETFUNCTION
J2
J3
Target Board
Transition Socket
J2
J3
Device-ICE
Header from
Processor Pak
Performance Pak