Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsIntegrated Circuits (ICs)SOIC 8 8 kBit 1 K x 8, 512 x 16

 2003-2012 Microchip Technology Inc. DS21796M-page 1

93AA76A/B/C, 93LC76A/B/C,

93C76A/B/C

Device Selection Table

Features:

• Low-Power CMOS Technology

• ORG Pin to Select Word Size for ‘76C’ Version

• 1024 x 8-bit Organization ‘A’ Devices (no ORG)

• 512 x 16-bit Organization ‘B’ Devices (no ORG)

• Program Enable Pin to Write-Protect the Entire

Array (‘76C’ version only)

• Self-Timed Erase/Write Cycles (including

Auto-Erase)

• Automatic ERAL Before WRAL

• Power-On/Off Data Protection Circuitry

• Industry Standard 3-Wire Serial I/O

• Device Status Signal (Ready/Busy)

• Sequential Read Function

• 1,000,000 Erase/Write Cycles

• Data Retention > 200 Years

• Pb-free and RoHS Compliant

• Temperature Ranges Supported:

Pin Function Table

Description:

The Microchip Technology Inc. 93XX76A/B/C devices

are 8Kbit, low-voltage, serial Electrically Erasable

PROMs (EEPROM). Word-selectable devices such as

the 93XX76C are dependent upon external logic levels

driving the ORG pin to set word size. The 93XX76A

devices provide dedicated 8-bit memory organization,

while the 93XX76B devices provide dedicated 16-bit

memory organization. A Program Enable (PE) pin allows

the user to write-protect the entire memory array.

Advanced CMOS technology makes these devices ideal

for low-power, nonvolatile memory applications. The

93XX Series is available in standard packages including

8-lead PDIP and SOIC, and advanced packaging includ-

ing 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/

TDFN and 8-lead TSSOP. All packages are Pb-free

(Matte Tin) finish.

Package Types (not to scale)

Part Number VCC Range ORG Pin PE Pin Word Size Temp Ranges Packages

93AA76A 1.8-5.5 No No 8-bit I P, SN, ST, MS, OT

93AA76B 1.8-5-5 No No 16-bit I P, SN, ST, MS, OT

93LC76A 2.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT

93LC76B 2.5-5.5 No No 16-bit I, E P, SN, ST, MS, OT

93C76A 4.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT

93C76B 4.5-5.5 No No 16-bit I, E P, SN, ST, MS, OT

93AA76C 1.8-5.5 Yes Yes 8- or 16-bit I P, SN, ST, MS, MC, MN

93LC76C 2.5-5.5 Yes Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN

93C76C 4.5-5.5 Yes Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN

- Industrial (I) -40°C to +85°C

- Automotive (E) -40°C to +125°C

Name Function

CS Chip Select

CLK Serial Data Clock

DI Serial Data Input

DO Serial Data Output

SS Ground

PE Program Enable – 93XX76C only

ORG Memory Configuration – 93XX76C only

CC Power Supply

CLK

(1)

ORG

(1)

PDIP/SOIC

(P, SN)

TSSOP/MSOP

CLK

(1)

ORG

(1)

(ST, MS)

SOT-23

CLK

(OT)

DFN/TDFN

CLK

ORG

VCC

(MC, MN)

Note 1: 93XX76C only.

8K Microwire Compatible Serial EEPROM

Summary of content (36 pages)

PAGE 1
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8K Microwire Compatible Serial EEPROM Device Selection Table Part Number VCC Range ORG Pin PE Pin Word Size Temp Ranges Packages 93AA76A 1.8-5.5 No No 8-bit I P, SN, ST, MS, OT 93AA76B 1.8-5-5 No No 16-bit I P, SN, ST, MS, OT 93LC76A 2.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT 93LC76B 2.5-5.5 No No 16-bit I, E P, SN, ST, MS, OT 93C76A 4.5-5.5 No No 8-bit I, E P, SN, ST, MS, OT 93C76B 4.5-5.
PAGE 2
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ....................................................
PAGE 3
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. Parameter Industrial (I): TA = -40°C to +85°C, VCC = +1.8V to 5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to 5.5V Min Max Units Conditions A1 FCLK Clock frequency — 3 2 1 MHz MHz MHz 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.8V VCC < 2.5V A2 TCKH Clock high time 200 250 450 — ns ns ns 4.5V VCC < 5.5V 2.5V VCC < 4.5V 1.
PAGE 4
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C FIGURE 1-1: CS SYNCHRONOUS DATA TIMING VIH TCSS VIL TCKH TCKL TCSH VIH CLK VIL TDIS TDIH VIH DI VIL DO (Read) DO (Program) Note: TCZ TPD TPD VOH VOL TCZ TSV VOH Status Valid VOL TSV is relative to CS. TABLE 1-3: INSTRUCTION SET FOR X16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1) Instruction SB Opcode Address READ 1 10 X EWEN 1 00 1 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 x x x x x x x x A8 A7 A6 A5 A4 A3 A2 A1 A0 Data In Data Out Req.
PAGE 5
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.0 FUNCTIONAL DESCRIPTION When the ORG pin (93XX76C) is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a High-Z state except when reading data from the device, or when checking the Ready/ Busy status during a programming operation.
PAGE 6
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.4 Erase The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction. The ERASE instruction forces all data bits of the specified address to the logical ‘1’ state.
PAGE 7
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.6 Erase/Write Disable and Enable (EWDS/EWEN) Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or VCC is removed from the device. The 93XX76A/B/C powers up in the Erase/Write Disable (EWDS) state. All programming modes must be preceded by an Erase/Write Enable (EWEN) instruction.
PAGE 8
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.8 Write The DO pin indicates the Ready/Busy status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction.
PAGE 9
3AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.9 Write All (WRAL) The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle.
PAGE 10
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.0 PIN DESCRIPTIONS TABLE 3-1: PIN DESCRIPTIONS PDIP SOIC TSSOP MSOP DFN(1) TDFN(1) SOT-23 CS 1 1 1 1 1 1 5 Chip Select CLK 2 2 2 2 2 2 4 Serial Clock Name Function DI 3 3 3 3 3 3 3 Data In DO 4 4 4 4 4 4 1 Data Out VSS 5 5 5 5 5 5 2 Ground ORG 6 6 6 6 6 6 — Organization/93XX76C only PE 7 7 7 7 7 7 — Program Enable/ 93XX76C only 8 8 8 8 8 8 6 Power Supply VCC Note 1: 3.
PAGE 11
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.6 Program Enable (PE) This pin allows the user to enable or disable the ability to write data to the memory array. If the PE pin is tied to VCC, the device can be programmed. If the PE pin is tied to VSS, programming will be inhibited. This pin cannot be floated – it must be tied to VCC or VSS. PE is not available on 93XX76A or 93XX76B. On those devices, programming is always enabled.  2003-2012 Microchip Technology Inc.
PAGE 12
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 4.0 PACKAGING INFORMATION 4.
PAGE 13
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 1st Line Marking Codes Part Number SOT-23 TSSOP 93AA76A DFN TDFN MSOP A76A I Temp. E Temp. I Temp. E Temp. I Temp. E Temp.
PAGE 14
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796M-page 14  2003-2012 Microchip Technology Inc.
PAGE 15
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2003-2012 Microchip Technology Inc.
PAGE 16
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 16  2003-2012 Microchip Technology Inc.
PAGE 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C .
PAGE 18
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 18  2003-2012 Microchip Technology Inc.
PAGE 19
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C ! " ## $ % ! .
PAGE 20
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 20  2003-2012 Microchip Technology Inc.
PAGE 21
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2003-2012 Microchip Technology Inc.
PAGE 22
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C " &' ()# $ % !* . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / DS21796M-page 22  2003-2012 Microchip Technology Inc.
PAGE 23
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C + + , " -(- $ % .
PAGE 24
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 24  2003-2012 Microchip Technology Inc.
PAGE 25
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C . ' , / 0* " 1 1#() $ % . .
PAGE 26
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 26  2003-2012 Microchip Technology Inc.
PAGE 27
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2003-2012 Microchip Technology Inc.
PAGE 28
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21796M-page 28  2003-2012 Microchip Technology Inc.
PAGE 29
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C . ' , / 0 " 1 1#(23 $ % . . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 /  2003-2012 Microchip Technology Inc.
PAGE 30
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C APPENDIX A: REVISION HISTORY Revision A (05/2003) Initial Release. Revision B (07/2003) Revision C (12/2003) Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision D (02/2004) Corrections to Device Selection Table, Table 1-1, Table 1-2, Section 2.4, Section 2.5, Section 2.8 and Section 2.9. Added note to Figure 2-7. Revision E (03/2005) Added DFN package. Revision F (04/2005) Added notes throughout.
PAGE 31
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
PAGE 32
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 33
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.. X PART NO. Device Tape & Reel Temperature Range Device: Tape & Reel: /XX X Package Examples: a) b) 93AA76A: 8K 1.8V Microwire Serial EEPROM (x8) 93AA76B: 8K 1.8V Microwire Serial EEPROM (x16) 93AA76C: 8K 1.
PAGE 34
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796M-page 34  2003-2012 Microchip Technology Inc.
PAGE 35
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 36
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