Datasheet

25AA256/25LC256
DS21822F-page 18 © 2007 Microchip Technology Inc.
(JEITA/EIAJ Standard, Formerly called SOIC)
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A 1.77 – 2.03
Molded Package Thickness A2 1.75 – 1.98
Standoff § A1 0.05 – 0.25
Overall Width E 7.62 – 8.26
Molded Package Width E1 5.11 – 5.38
Overall Length D 5.13 – 5.33
Foot Length L 0.51 – 0.76
Foot Angle φ 0° – 8°
Lead Thickness c 0.15 – 0.25
Lead Width b 0.36 – 0.51
Mold Draft Angle Top α – – 15°
Mold Draft Angle Bottom β – – 15°
φ
β
α
L
c
A2
A1
A
b
12
e
E
E1
N
D
Microchip Technology Drawing C04-056B