Datasheet

25AA256/25LC256
DS21822G-page 14  2003-2013 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
T/XXXNNN
XXXXXXXX
YYWW
8-Lead PDIP
8-Lead SOIC (3.90 mm)
XXXXYYWW
XXXXXXXT
NNN
XXXX
TYWW
8-Lead TSSOP
NNN
I/P 1L7
25LC256
0528
Example:
Example:
SN 0528
25LC256I
1L7
1L7
5LE
I528
Example:
8-Lead DFN
Example:
XXXXXXX
T/XXXXX
YYWW
25LC256
I/MF
0528
1L7
NNN
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
3
e
TSSOP 1st Line Marking Codes
Device Standard Rotated
25AA256 5AE 5AEX
25LC256 5LE 5LEX
8-Lead SOIC (208 mil)
XXXXXXXX
XXXXXXXX
YYWWNNN
Example:
25LC256
05281L7
3
e
I/SM