Datasheet

2010 Microchip Technology Inc. DS21836H-page 27
25AA1024
APPENDIX A:
REVISION HISTORY
Revision C (02/2007)
Revised Features Section (Self-timed Erase and Write
Cycles); Revised Table 1-1 (Param. D012 and D13);
Table 1-2 (Param. 20-24); Revised Package Marking
Information; Replaced Package Drawings; Revised
Product ID System Section (SM package). Changed
PICmicro to PIC.
Revision D (07/2007)
Revised Features; Revised Tables 1-1 and 1-2 (added
Industrial temp. and revised parameters 22-23);
Replaced Package Drawings (Rev. AP); Revised
Product ID System; Changed Flash to EEPROM.
Revision E (10/2007)
Removed 25LC1024 part number; New data sheet
created for 25LC1024 (DS22064); Revised Tables;
Updates throughout.
Revision F (5/2008)
Modified parameter D006 in Table 1-1; Revised
Package Marking Information; Replaced Package
Drawings.
Revision G (01/2010)
Added 8-Lead (MF) DFN-S Land Pattern; Replaced
8-Lead (SM) SOIJ Land Pattern.
Revision H (05/10)
Revised Table 1-2, Param. No 25 Conditions; Revised
Section 2.2, added note.