Datasheet

© 2009 Microchip Technology Inc. DS22184A-page 27
24AA32AF/24LC32AF
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X /XX
PackageTemperature
Range
Device
Device: 24AA32AF: 1.7V, 32 Kbit I
2
C Serial EEPROM
with half-array write-protect
24AA32AFT:1.7V, 32 Kbit I
2
C Serial EEPROM
with half-array write-protect (Tape and Reel)
24LC32AF: 2.5V, 32 Kbit I
2
C Serial EEPROM
with half-array write-protect
24LC32AFT: 2.5V, 32 Kbit I
2
C Serial EEPROM
with half-array write-protect (Tape and Reel)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
MNY
(1)
= TDFN (2x3x0.75mm body), 8-lead
OT = SOT-23 (Tape and Reel only), 5-lead
Examples:
a) 24AA32AF-I/P: Industrial Temperature,1.7V,
PDIP package
b) 24AA32AF-I/SN: Industrial Temperature,1.7V,
SOIC package
c) 24AA32AF-I/SM: Industrial Tempera-
ture.,1.7V, SOIC (5.28 mm) package
d) 24AA32AF-I/ST: Industrial Temperature.,1.7V,
TSSOP package
e) 24LC32AF-I/P: Industrial Temperature, 2.5V,
PDIP package
f) 24LC32AF-E/SN: Automotive Temperature,
2.5V SOIC package
g) 24LC32AF-E/SM: Automotive Temperature,
2.5V SOIC (5.28 mm) package
h) 24LC32AFT-I/ST: Industrial Temperature,
2.5V, TSSOP package, Tape and Reel
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.