24AA256/24LC256/24FC256 256K I2C™ CMOS Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA256 1.7-5.5V 400 kHz(1) I, E 24LC256 2.5-5.5V 400 kHz I, E 24FC256 1.7-5.5V 1 MHz(2) I • Temperature Ranges: - Industrial (I): - Automotive (E): Description: The Microchip Technology Inc. 24AA256/24LC256/ 24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.7V to 5.5V).
4AA256/24LC256/24FC256 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ..................................................................
24AA256/24LC256/24FC256 TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V Automotive (E): VCC = +1.7V to 5.5V AC CHARACTERISTICS Param. No. Sym. Characteristic Min. Max. Units TA = -40°C to +85°C TA = -40°C to +125°C Conditions 1 FCLK Clock frequency — — — — 100 400 400 1000 kHz 1.7V VCC 2.5V 2.5V VCC 5.5V 1.7V VCC 2.5V 24FC256 2.5V VCC 5.5V 24FC256 2 THIGH Clock high time 4000 600 600 500 — — — — ns 1.7V VCC 2.5V 2.
24AA256/24LC256/24FC256 Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V Automotive (E): VCC = +1.7V to 5.5V AC CHARACTERISTICS (Continued) Param. No. Sym. Characteristic TA = -40°C to +85°C TA = -40°C to +125°C Min. Max. Units Conditions — — — — 3500 900 900 400 ns 1.7 V VCC 2.5V 2.5 V VCC 5.5V 1.7V VCC 2.5V 24FC256 2.5 V VCC 5.5V 24FC256 4700 1300 1300 500 — — — — ns 1.7V VCC 2.5V 2.5V VCC 5.5V 1.7V VCC 2.5V 24FC256 2.5V VCC 5.
24AA256/24LC256/24FC256 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
24AA256/24LC256/24FC256 4.0 BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line, while the clock line is high, will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). 4.1 Bus Not Busy (A) Both data and clock lines remain high. 4.
24AA256/24LC256/24FC256 FIGURE 4-1: (A) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) Start Condition Address or Acknowledge Valid (D) (C) (A) SCL SDA FIGURE 4-2: Data Allowed to Change Stop Condition ACKNOWLEDGE TIMING Acknowledge Bit SCL SDA 1 2 3 4 5 6 7 Data from transmitter Transmitter must release the SDA line at this point, allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data. 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code. For the 24XX256, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX256 devices on the same bus and are used to select which device is accessed.
24AA256/24LC256/24FC256 6.0 WRITE OPERATIONS 6.1 Byte Write Following the Start condition from the master, the control code (four bits), the Chip Select (three bits) and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow after it has generated an Acknowledge bit during the ninth clock cycle.
24AA256/24LC256/24FC256 FIGURE 6-1: BYTE WRITE SDA Line S T A R T Bus Activity AA S1 0 10A 2 10 0 Bus Activity Master Control Byte Bus Activity Master SDA Line Bus Activity Address Low Byte S T O P Data x P A C K x = “don’t care” bit FIGURE 6-2: Address High Byte A C K A C K A C K PAGE WRITE S T A R T Control Byte Address High Byte AAA S101 02 1 00 x = “don’t care” bit DS20001203T-page 10 Address Low Byte S T O P Data Byte 63 Data Byte 0 P x A C K A C K A C K A C K A C K
24AA256/24LC256/24FC256 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition, followed by the control byte for a Write command (R/W = 0).
24AA256/24LC256/24FC256 8.0 READ OPERATION 8.2 Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX256 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set.
24AA256/24LC256/24FC256 FIGURE 8-3: Bus Activity Master SEQUENTIAL READ Control Byte Data (n) Data (n + 1) S T O P Data (n + x) Data (n + 2) P SDA Line Bus Activity A C K 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) 24AA256 I/P e3 017 0510 XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXT XXXXYYWW NNN Legend: XX...
24AA256/24LC256/24FC256 Package Marking Information (Continued) Example: 8-Lead TSSOP XXXX TYWW NNN 4LD I510 017 8-Lead MSOP Example: XXXXXT YWWNNN 4L256I 510017 Example: 8-Lead DFN-S 24LC256 I/MF e3 0510 017 XXXXXXX T/XXXXX YYWW NNN Example: 8-Lead TDFN EF4 0510 017 XXX YWW NN Example: 8-Lead Chip Scale 249 A051 0017 XXX XYYW WNNN First Line Marking Codes Part No.
24AA256/24LC256/24FC256 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 6 &! ' ! 9 ' &! 7"') % ! 7,8. 7 7 & ; < & & 7: 1 , = = - 1 ! & & = = .
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 18 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 ! "" #$ %& ! ' 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 20 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 22 1998-2013 Microchip Technology Inc.
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AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 24 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 26 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 , $ * - ., /01 , 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 e D L b N N K E2 E EXPOSED PAD NOTE 1 1 2 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 6 &! ' ! 9 ' &! 7"') % ! 99 . .
24AA256/24LC256/24FC256 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 30 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 , $ * - . 20 0 %31 ( , 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 DS20001203T-page 32 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203T-page 34 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256 APPENDIX A: REVISION HISTORY Revision L Corrections to Section 1.0, Electrical Characteristics. Revision M Added 1.8V 400 kHz option for 24FC256. Revision N Revised Sections 2.1 and 2.4. Removed 14-Lead TSSOP Package. Revision P Revised Features; Changed 1.8V voltage to 1.7V; Replaced Package Drawings; Revised markings (8-lead SOIC); Revised Product ID System. Revision Q (05/10) Revised Table 1-1, Table 1-2, Section 6.1; Updated Package Drawings.
24AA256/24LC256/24FC256 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
24AA256/24LC256/24FC256 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
24AA256/24LC256/24FC256 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X Device Device: /XX Temperature Range 24AA256: 24AA256T: 24LC256: 24LC256T: 24FC256: 24FC256T: Temperature Range: I E Package: P SN SM ST MF = = Package 256 Kbit 1.7V I2C Serial EEPROM 256 Kbit 1.7V I2C Serial EEPROM Tape and Reel) 256 Kbit 2.5V I2C Serial EEPROM 256 Kbit 2.
24AA256/24LC256/24FC256 NOTES: DS20001203T-page 40 1998-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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