Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsIntegrated Circuits (ICs)SOIC 8 8 kBit 4 x 256 x 8

24AA08/24LC08B

Device Selection Table

Features:

• Single supply with operation down to 1.8V

• Low-power CMOS technology:

- 1 mA active current, typical

-1μA standby current, typical (I-temp)

• Organized as 4 blocks of 256 bytes (4 x 256 x 8)

• 2-wire serial interface bus, I

C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (<2.5V) and 400 kHz (≥2.5V) compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 16 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP

packages

• 5-lead SOT-23 package

• Standard and Pb-free finishes available

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description:

The Microchip Technology Inc. 24AA08/24LC08B

(24XX08*) is a 8 Kbit Electrically Erasable PROM. The

device is organized as four blocks of 256 x 8-bit

memory with a 2-wire serial interface. Low voltage

design permits operation down to 1.8V, with standby

and active currents of only 1 μA and 1 mA,

respectively. The 24XX08 also has a page write

capability for up to 16 bytes of data. The 24XX08 is

available in the standard 8-pin PDIP, surface mount

SOIC, TSSOP, 2x3 DFN and MSOP packages, and is

also available in the 5-lead SOT-23 package.

Block Diagram

Package Types

Part

Number

VCC

Range

Max Clock

Frequency

Temp

Ranges

24AA08 1.8-5.5 400 kHz

(1)

24LC08B 2.5-5.5 400 kHz I, E

Note 1: 100 kHz for VCC <2.5V

EEPROM

Array

Page

YDEC

XDEC

Sense Amp.

Memory

Control

Logic

I/O

Control

Logic

I/O

SDA

SCL

VSS

R/W Control

Latches

Generator

VCC

SCL

SDA

PDIP, MSOP

SOIC, TSSOP

SCL

SDA

DFN

SCL

SDA

SOT-23-5

SCL

Vss

SDA

Vcc

Note: Pins A0, A1 and A2 are not used by the 24XX08. (No

internal connections).

8K I

™

Serial EEPROM

*24XX08 is used in this document as a generic part

number for the 24AA08/24LC08B devices.

Summary of content (26 pages)

PAGE 1
24AA08/24LC08B 8K I2C™ Serial EEPROM Device Selection Table Description: Part Number VCC Range Max Clock Frequency Temp Ranges 24AA08 1.8-5.5 400 kHz(1) I 24LC08B 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features: • Single supply with operation down to 1.
PAGE 2
4AA08/24LC08B Package TypeElectrical Characteristics Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ....................................................................
PAGE 3
24AA08/24LC08B TABLE 1-2: AC CHARACTERISTICS VCC = +1.8V to +5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C AC CHARACTERISTICS Param. Symbol No. Characteristic Min Typ Max Units Conditions 1 FCLK Clock frequency — — — — 400 100 kHz 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V (24AA08) 2 THIGH Clock high time 600 4000 — — — — ns 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V (24AA08) 3 TLOW Clock low time 1300 4700 — — — — ns 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.
PAGE 4
24AA08/24LC08B FIGURE 1-1: BUS TIMING DATA 5 4 2 3 SCL 7 SDA IN 8 10 9 6 14 12 11 SDA OUT FIGURE 1-2: BUS TIMING START/STOP D4 SCL 6 7 10 SDA Start DS21710D-page 4 Stop © 2005 Microchip Technology Inc.
PAGE 5
24AA08/24LC08B 2.0 FUNCTIONAL DESCRIPTION The 24XX08 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX08 works as slave.
PAGE 6
24AA08/24LC08B 3.6 FIGURE 3-2: Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 2-2). The control byte consists of a four-bit control code. For the 24XX08, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0). B2 is a “don’t care” for the 24XX08.
PAGE 7
24AA08/24LC08B 4.0 WRITE OPERATION 4.1 Byte Write 4.2 The write control byte, word address and the first data byte are transmitted to the 24XX08 in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 16 data bytes to the 24XX08, which are temporarily stored in the onchip page buffer and will be written into memory once the master has transmitted a Stop condition.
PAGE 8
24AA08/24LC08B 5.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0).
PAGE 9
24AA08/24LC08B 7.0 READ OPERATION 7.3 Sequential Read Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. Sequential reads are initiated in the same way as a random read, except that once the 24XX08 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read.
PAGE 10
24AA08/24LC08B FIGURE 7-2: RANDOM READ BUS ACTIVITY MASTER SDA LINE S T A R T S BUS ACTIVITY MASTER Control Byte S T O P P Data (n) S A C K A C K BUS ACTIVITY FIGURE 7-3: S T A R T Word Address (n) Control Byte A C K N O A C K SEQUENTIAL READ Control Byte Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + X) P SDA LINE BUS ACTIVITY DS21710D-page 10 A C K A C K A C K A C K N O A C K © 2005 Microchip Technology Inc.
PAGE 11
24AA08/24LC08B 8.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 7-1. TABLE 8-1: PIN FUNCTION TABLE Name PDIP SOIC TSSOP DFN MSOP SOT-23 A0 1 1 1 1 1 — Not Connected A1 2 2 2 2 2 — Not Connected 8.1 A2 3 3 3 3 3 — Not Connected VSS 4 4 4 4 4 2 Ground SDA 5 5 5 5 5 3 Serial Address/Data I/O SCL 6 6 6 6 6 1 Serial Clock WP 7 7 7 7 7 5 Write-Protect Input VCC 8 8 8 8 8 4 +1.8V to 5.
PAGE 12
24AA08/24LC08B 9.0 PACKAGING INFORMATION 9.
PAGE 13
24AA08/24LC08B 8-Lead 2x3 DFN Example: XXX YWW NN 244 527 13 Legend: XX...
PAGE 14
24AA08/24LC08B 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B
PAGE 15
24AA08/24LC08B 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .
PAGE 16
24AA08/24LC08B 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES NOM MAX 8 .026 .033 .002 .246 .169 .114 .
PAGE 17
24AA08/24LC08B 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .
PAGE 18
24AA08/24LC08B 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) E E1 p B p1 n D 1 α c A Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L φ Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic φ L β B α β MIN .035 .035 .000 .102 .059 .110 .014 0 .
PAGE 19
24AA08/24LC08B 8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated p D b n L E PIN 1 ID INDEX AREA (NOTE 2) E2 EXPOSED METAL PAD 2 1 D2 BOTTOM VIEW TOP VIEW A A1 A3 EXPOSED TIE BAR (NOTE 1) Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Contact Width Contact Length Units Dimension Limits n p (Note 3) (Note 3) A A1 A3 D D2 E E2 b L MIN .031 .000 .055 .047 .008 .
PAGE 20
24AA08/24LC08B APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC08B standard marking code. Revision D Added DFN package. DS21710D-page 20 © 2005 Microchip Technology Inc.
PAGE 21
24AA08/24LC08B THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
PAGE 22
24AA08/24LC08B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 23
24AA08/24LC08B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X X /XX Temperature Package Range Lead Finish I2C 24AA08: 24AA08T: = 1.8V, 16 Kbit Serial EEPROM = 1.8V, 16 Kbit I2C Serial EEPROM (Tape and Reel) 24LC08B: = 2.5V, 16 Kbit I2C Serial EEPROM 24LC08BT: = 2.
PAGE 25
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 26
WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.