Datasheet
1998-2013 Microchip Technology Inc. DS20001203U-page 39
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX
PackageTemperature
Range
Device
Device: 24AA256: 256 Kbit 1.7V I
2
C Serial
EEPROM
24AA256T: 256 Kbit 1.7V I
2
C Serial
EEPROM Tape and Reel)
24LC256: 256 Kbit 2.5V I
2
C Serial
EEPROM
24LC256T: 256 Kbit 2.5V I
2
C Serial
EEPROM Tape and Reel)
24FC256: 256 Kbit High Speed I
2
C Serial
EEPROM
24FC256T: 256 Kbit High Speed I
2
C Serial
EEPROM Tape and Reel)
Temperature
Range:
I= -40C to +85C
E= -40C to +125C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
SM = Plastic SOIJ (5.28 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MF = Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
MS = Plastic Micro Small Outline (MSOP),
8-lead
MNY
(2)
=Dual, Flat, No Lead (TDFN) (2x3 mm
body), 8-lead
CS16K
(1)
= Chip Scale (CS), 8-lead (I-temp,
“AA”, Tape and Reel only)
Examples:
a) 24AA256-I/P: Industrial Temp.,
1.7V, PDIP package.
b) 24AA256T-I/SN: Tape and Reel,
Industrial Temp., 1.7V, SOIC
package.
c) 24AA256-I/ST: Industrial Temp.,
1.7V, TSSOP package.
d) 24AA256-I/MS: Industrial Temp.,
1.7V, MSOP package.
e) 24LC256-E/P: Extended Temp.,
2.5V, PDIP package.
f) 24LC256-I/SN: Industrial Temp.,
2.5V, SOIC package.
g) 24LC256T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
h) 24LC256-I/MS: Industrial Temp,
2.5V, MSOP package.
i) 24FC256-I/P: Industrial Temp,
1.7V, High Speed, PDIP package.
j) 24FC256-I/SN: Industrial Temp,
1.7V, High Speed, SOIC package.
k) 24FC256T-I/SN: Tape and Reel,
Industrial Temp, 1.7V, High Speed,
SOIC package.
l) 24AA256T-CS16K: Industrial Temp,
1.7V, CS package, Tape and Reel.
m) 24AA256T-E/SN: Tape and Reel,
Extended Temp., 1.7V, SOIC
package.
Note 1: “16K” indicates 160K technology.
2: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.