Information

www.microchip.com/memory
4
Serial EEPROM
Microchip Serial EEPROM Field Return Data
• Industry’s lowest eld return numbers, best suited for
automotive applications
• A decade of improvement
Microchip Serial EEPROM Endurance
• All devices from supplier A and B failed before 2 million E/W
cycles at 85°C
• Testing shows zero Microchip EEPROM failures even at
2 million E/W cycles at 85°C
Standard and Specialty/Application-Specic
EEPROMs
Total Endurance™ Software Model
Total Endurance Software Model provides a comprehensive
model that helps estimate the endurance and reliability of
Microchip Serial EEPROM devices. By providing operating
conditions based on your application, all design trade-os aect-
ing reliability can be accurately estimated both graphically and
numerically in PPM, FIT and MTBF modes, saving time and en-
suring a truly robust design. www.microchip.com/totalendurance
2008 2009 2010 2011 2012 2013 2014 2015
2016 2017
0.2
0.4
0.6
0.8
1.0
0
500,000 1,000,000 1,500,000 2,000,000
30
60
90
120
150
0
E/W Cycles at 85C
Supplier A Supplier B Supplier C Supplier D Microchip
Serial EEPROMs
Standard
EEPROMs
I
2
C
128b–2 Mb, 1.7–5.5V
UNI/O
®
Bus
1–16 Kb, 1.8–5.5V
MAC Address Chips
EUI-48™ & EUI-64™ Node Address
Unique ID
1 Kbit–256 Kbit, 1.7–5.5V
Micorwire
1–16 Kb, 1.7–5.5V
SPI
1 Kb–2 Mb, 1.7–5.5V
Partial Array Write Protect
½, ¼ and Whole Array WP Options
DIMM-DDR2/3/4
Reversible Software Write Protect; I
2
C
Extended Temperature
−55 to 150°C
VESA Monitors
DDC1™/DDC2™ Interface
Very-Low Voltage
1.5V EEPROM
Specialty/Application
Specific EEPROMs
Single-Wire
1 Kbit, 1.7–4.5V
Serial EEPROM Bus Comparison
Microchip’s best-in-class eld performance is the combined result of Wafer Level Burn-In and Wafer Probe-Quality Screens.
Parameter I
2
C Microwire Single-Wire UNI/O
®
Bus SPI
Density Range
128 bits–2 Mbit 1 Kbit–16 Kbit 1 Kbit 1 Kbit–16 Kbit 1 Kbit–2 Mbit
Speed
up to 1 MHz up to 3 MHz 125 Kbps up to 100 kHz up to 20 MHz
I/O Pins
2: Clock, Data 4: Clock, CS, DI, DO 1: Clock/Data 1: Clock/Data 4: SCK, CS, DI, DO
Package Options
PDIP, SOIC, SOIJ,
TSSOP, MSOP, 2 × 3
TDFN, 6 × 5 DFN,
SOT-23, SC70, WLCSP
PDIP, SOIC, TSSOP,
MSOP, 2 × 3 TDFN,
SOT-23
SOIC, SOT-23, UDFN,
XSFN, WLCSP
PDIP, SOIC, TSSOP,
MSOP, 2 × 3 TDFN,
SOT-23, TO92, WLCSP
PDIP, SOIC, SOIJ,
TSSOP, MSOP, 2 × 3
TDFN, 6 × 5 DFN,
SOT-23, WLCSP
Security Options
Hardware/Software Hardware Software Software Hardware/Software
Pricing
Fewest features/lowest cost –––––––––––––––––––––––––––––––––––––––— Most features/highest cost