Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsIntegrated Circuits (ICs)PDIP 8 1 kBit 128 x 8

 1997-2012 Microchip Technology Inc. DS21201K-page 1

24C01C

Features:

• Single Supply with Operation from 4.5V to 5.5V

• Low-Power CMOS Technology:

- Read current 1 mA, max.

- Standby current 5 A, max.

• 2-Wire Serial Interface, I

C™ Compatible

• Cascadable up to Eight Devices

• Schmitt Trigger Inputs for Noise Suppression

• Output Slope Control to Eliminate Ground Bounce

• 100 kHz and 400 kHz Clock Compatibility

• Page Write Time 1 ms max.

• Self-Timed Erase/Write Cycle

• 16-Byte Page Write Buffer

• ESD Protection >4000V

• More than 1 Million Erase/Write Cycles

• Data Retention >200 Years

• Factory Programming Available

• Packages include 8-lead PDIP, SOIC, TSSOP,

DFN, TDFN, MSOP and 6-lead SOT-23

• Pb-Free and RoHS Compliant

• Temperature Ranges:

Description:

The Microchip Technology Inc. 24C01C is a 1K bit

Serial Electrically Erasable PROM with a voltage range

of 4.5V to 5.5V. The device is organized as a single

block of 128 x 8-bit memory with a 2-wire serial

interface. Low-current design permits operation with

max. standby and active currents of only 5 A and 1

mA, respectively. The device has a page write capabil-

ity for up to 16 bytes of data and has fast write cycle

times of only 1 ms for both byte and page writes. Func-

tional address lines allow the connection of up to eight

24C01C devices on the same bus for up to 8K bits of

contiguous EEPROM memory. The device is available

in the standard 8-pin PDIP, 8-pin SOIC (3.90 mm),

8-pin 2x3 DFN and TDFN, 8-pin MSOP and TSSOP

packages. The 24C01C is also available in the 6-lead

SOT-23 package.

Block Diagram

Package Types

- Industrial (I): -40C to +85C

- Automotive (E): -40C to +125C

I/O

Control

Logic

Memory

Control

Logic

XDEC

HV Generator

EEPROM

Array

YDEC

VSS

Sense Amp.

R/W Control

SDA

SCL

A0 A1 A2

VCC

Test

SCL

SDA

PDIP, MSOP

SOIC, TSSOP

Tes t

SCL

SDA

DFN/TDFN

Tes t

SCL

SDA

SOT-23

SCL

SDA

1K 5.0V I

C™ Serial EEPROM

Summary of content (36 pages)

PAGE 1
24C01C 1K 5.0V I2C™ Serial EEPROM Features: Description: • Single Supply with Operation from 4.5V to 5.5V • Low-Power CMOS Technology: - Read current 1 mA, max. - Standby current 5 A, max. • 2-Wire Serial Interface, I2C™ Compatible • Cascadable up to Eight Devices • Schmitt Trigger Inputs for Noise Suppression • Output Slope Control to Eliminate Ground Bounce • 100 kHz and 400 kHz Clock Compatibility • Page Write Time 1 ms max.
PAGE 2
4C01C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...................................................................................
PAGE 3
24C01C TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +4.5V to 5.5V Automotive (E): VCC = +4.5V to 5.5V AC CHARACTERISTICS Param. No. Sym. Characteristic Min. Max.
PAGE 4
24C01C FIGURE 1-1: BUS TIMING DATA 5 SCL 7 SDA IN D4 2 3 8 9 4 10 6 14 11 12 SDA OUT DS21201K-page 4  1997-2012 Microchip Technology Inc.
PAGE 5
24C01C 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE 8-pin PDIP 8-pin SOIC 8-pin TSSOP 8-pin MSOP 8-pin DFN/TDFN SOT-23 A0 1 1 1 1 1 5 Chip Select A1 2 2 2 2 2 4 Chip Select Name Function A2 3 3 3 3 3 — Chip Select VSS 4 4 4 4 4 2 Ground SDA 5 5 5 5 5 3 Serial Data SCL 6 6 6 6 6 1 Serial Clock Test 7 7 7 7 7 — Test VCC 8 8 8 8 8 6 +4.5V to 5.5V Power Supply 2.
PAGE 6
24C01C 3.0 FUNCTIONAL DESCRIPTION The 24C01C supports a bidirectional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus has to be controlled by a master device that generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions, while the 24C01C works as slave.
PAGE 7
24C01C FIGURE 4-1: SCL (A) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (C) (D) Start Condition Address or Acknowledge Valid (C) (A) SDA FIGURE 4-2: Stop Condition Data Allowed to Change ACKNOWLEDGE TIMING Acknowledge Bit SCL SDA 1 2 3 4 5 6 7 Data from transmitter Transmitter must release the SDA line at this point allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.  1997-2012 Microchip Technology Inc.
PAGE 8
24C01C 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code; for the 24C01C this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24C01C devices on the same bus and are used to select which device is accessed.
PAGE 9
24C01C 6.0 WRITE OPERATIONS 6.1 Byte Write After the receipt of each word, the four lower order Address Pointer bits are internally incremented by one. The higher order four bits of the word address remains constant. If the master should transmit more than 16 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten.
PAGE 10
24C01C 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0).
PAGE 11
24C01C 8.0 READ OPERATION 8.2 Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is done by sending the word address to the 24C01C as part of a write operation. Read operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to one.
PAGE 12
24C01C 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24C01CI SN e3 0527 13F Example: 4C1C TYWW I527 NNN 13F XXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN 8-Lead 2x3 TDFN DS21201K-page 12 24C01C I/P e3 13F 0527 XXXX 8-Lead MSOP XXX YWW NN Example: Example: 4C1CI 52713F Example: 2N7 527 13 Example: AN7 527 13  1997-2012 Microchip Technology Inc.
PAGE 13
24C01C 1st Line Marking Codes Part Number 24C01C Note: TSSOP MSOP 4C1C 4C1CT DFN TDFN SOT-23 I Temp. E Temp. I Temp. E Temp. I Temp. E Temp. 2N7 2N8 AN7 AN8 HANN HBNN T = Temperature grade (I, E) 6-Lead SOT-23 HAEC XXNN Legend: XX...
PAGE 14
24C01C 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 6 &! ' ! 9 ' &! 7"') % ! 7,8. 7 7 & ; < & & 7: 1 , = = - 1 ! & & = = .
PAGE 15
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1997-2012 Microchip Technology Inc.
PAGE 16
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21201K-page 16  1997-2012 Microchip Technology Inc.
PAGE 17
24C01C ! "" #$ %& ! ' 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  1997-2012 Microchip Technology Inc.
PAGE 18
24C01C () )" * ! ( +%+ ( ! 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 6 &! ' ! 9 ' &! 7"') % ! 99 . . 7 7 7: ; < & : 8 & = = < = # # 4 4 !! & # %% ? 1 , : > #& . # # 4 > #& .
PAGE 19
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1997-2012 Microchip Technology Inc.
PAGE 20
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21201K-page 20  1997-2012 Microchip Technology Inc.
PAGE 21
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1997-2012 Microchip Technology Inc.
PAGE 22
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21201K-page 22  1997-2012 Microchip Technology Inc.
PAGE 23
24C01C , $ * - .' /0 0 %& , 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 6 &! ' ! 9 ' &! 7"') % ! 99 . .
PAGE 24
C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21201K-page 24  1997-2012 Microchip Technology Inc.
PAGE 25
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1997-2012 Microchip Technology Inc.
PAGE 26
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21201K-page 26  1997-2012 Microchip Technology Inc.
PAGE 27
24C01C , $ * - . /0 0 %12 ( , 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  1997-2012 Microchip Technology Inc.
PAGE 28
24C01C 3 ! (" " !( !( / 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 6 &! ' ! 9 ' &! 7"') % ! 99 . . 7 7 7: & 1 , :"&! # 9 # & 1 , : 8 & ; ? = < = - = : > #& .
PAGE 29
24C01C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1997-2012 Microchip Technology Inc.
PAGE 30
24C01C APPENDIX A: REVISION HISTORY Revision A (06/1997) Initial release. Revision B (07/1998) Revision C (08/1999) Revision D (12/2003) Corrections to Section 1.0, Electrical Characteristics. Revision E (04/2005) Added DFN package. Revision F (01/2007) Revised Features Section; Deleted Commercial Temp; Replaced Package Drawings; Replaced On-Line Support page; Revised Product ID System. Revision G (03/2007) Replaced Package Drawings (Rev. AM).
PAGE 31
24C01C THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
PAGE 32
24C01C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 33
24C01C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
PAGE 34
24C01C NOTES: DS21201K-page 34  1997-2012 Microchip Technology Inc.
PAGE 35
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 36
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