Datasheet

2010 Microchip Technology Inc. DS21191S-page35
24AA128/24LC128/24FC128
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX
PackageTemperature
Range
Device
Device: 24AA128: 128 Kbit 1.7V I
2
C Serial EEPROM
24AA128T: 128 Kbit 1.7V I
2
C Serial EEPROM
(Tape and Reel)
24LC128: 128 Kbit 2.5V I
2
C Serial EEPROM
24LC128T: 128 Kbit 2.5V I
2
C Serial EEPROM
(Tape and Reel)
24FC128: 128 Kbit High Speed I
2
C Serial
EEPROM
24FC128T: 128 Kbit High Speed I
2
C Serial
EEPROM (Tape and Reel)
Temperature
Range:
I= -40C to +85C
E= -40C to +125C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body),
8-lead
SM = Plastic SOIC (5.28 mm body),
8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MF = Dual, Flat, No Lead (DFN-S)
(6x5 mm body), 8-lead
MNY
(1)
= TDFN (2x3x0.75 mm body), 8-lead
MS = Plastic Micro Small Outline
(MSOP), 8-lead
CS15K
(2)
= Chip Scale (CS), 8-lead (I-temp,
AA, Tape and Reel only)
Note 1: Y indicates a Nickel Palladium Gold (NiPdAu) finish.
2: 15K indicates 150K technology
Examples:
a) 24AA128-I/P: Industrial Temp.,
1.7V, PDIP package.
b) 24AA128T-I/SN: Tape and Reel,
Industrial Temp., 1.7V, SOIC
package.
c) 24AA128-I/ST: Industrial Temp.,
1.7V, TSSOP package.
d) 24AA128-I/MS: Industrial Temp.,
1.7V, MSOP package.
e) 24AA128T-I/CS15K:Industrial
Temp., 1.7V, CS package, Tape and
Reel
f) 24LC128-E/P: Extended Temp.,
2.5V, PDIP package.
g) 24LC128-I/SN: Industrial Temp.,
2.5V, SOIC package.
h) 24LC128T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
i) 24LC128-I/MS: Industrial Temp.,
2.5V, MSOP package.
j) 24LC128T-I/MNY: Tape and Reel,
Industrial Temp., 2.5V, TDFN
package.
k) 24FC128-I/P: Industrial Temp.,
1.7V, High Speed, PDIP package.
l) 24FC128-I/SN: Industrial Temp.,
1.7V, High Speed, SOIC package.
m) 24FC128T-I/SN: Tape and Reel,
Industrial Temp., 1.7V, High Speed,
SOIC package