Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsIntegrated Circuits (ICs)SOT 23 5 128 Bit 16 x 8

24AA00/24LC00/24C00

Device Selection Table

Features:

• Single supply with operation down to 1.7V for

24AA00 devices, 2.5V for 24LC00 devices

• Low-power CMOS technology:

- Read current 500 μA, typical

- Standby current 100 nA, typical

• 2-wire serial interface, I

C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz and 400 kHz clock compatibility

• Page write time 3 ms, typical

• Self-timed erase/write cycle

• ESD protection >4000V

• More than 1 million erase/write cycles

• Data retention >200 years

• Factory programming available

• Packages include 8-lead PDIP, SOIC, TSSOP,

DFN and 5-lead SOT-23

• Pb-free and RoHS compliant

• Temperature ranges available:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description:

The Microchip Technology Inc. 24AA00/24LC00/

24C00 (24XX00*) is a 128-bit Electrically Erasable

PROM memory organized as 16 x 8 with a 2-wire

serial interface. Low-voltage design permits operation

down to 1.7 volts for the 24AA00 version, and every

version maintains a maximum standby current of only

1 μA and typical active current of only 500 μA. This

device was designed for where a small amount of

EEPROM is needed for the storage of calibration

values, ID numbers or manufacturing information, etc.

The 24XX00 is available in 8-pin PDIP, 8-pin SOIC

(3.90 mm), 8-pin TSSOP, 8-pin 2x3 DFN and the 5-pin

SOT-23 packages.

Package Types

Block Diagram

Pin Function Table

Device VCC Range Temp Range

24AA00 1.7-5.5 I

24LC00 2.5-5.5 I

24C00 4.5-5.5 I,E

Name Function

SS Ground

SDA Serial Data

SCL Serial Clock

CC +1.7V to 5.5V (24AA00)

+2.5V to 5.5V (24LC00)

+4.5V to 5.5V (24C00)

NC No Internal Connection

8-PIN PDIP/SOIC

8-PIN TSSOP

5-PIN SOT-23

Vss

SCL

SDA

VCC

SCL

SDA

SCL

SDA

VCC

DFN

SCL

SDA

HV Generator

EEPROM

Array

YDEC

XDEC

Sense AMP

R/W

Control

Memory

Control

Logic

I/O

Control

Logic

SDA

SCL

VCC

VSS

128-Bit I

™

Bus Serial EEPROM

*24XX00 is used in this document as a generic part number for

the 24AA00/24LC00/24C00 devices.

C is a trademark of Philips Corporation.

Summary of content (24 pages)

PAGE 1
24AA00/24LC00/24C00 128-Bit I2C™ Bus Serial EEPROM Device Selection Table Package Types Device VCC Range Temp Range 24AA00 1.7-5.5 I NC 1 8 24LC00 2.5-5.5 I NC 2 7 NC 24C00 4.5-5.5 I,E NC 3 6 SCL Vss 4 5 SDA 8-PIN PDIP/SOIC Features: • Single supply with operation down to 1.7V for 24AA00 devices, 2.
PAGE 2
4AA00/24LC00/24C00 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ......................................................................
PAGE 3
24AA00/24LC00/24C00 TABLE 1-2: AC CHARACTERISTICS All Parameters apply across all recommended operating ranges unless otherwise noted Parameter Industrial (I): Automotive (E): Symbol TA = -40°C to +85°C, VCC = 1.8V to 5.5V TA = -40°C to +125°C, VCC = 4.5V to 5.5V Min Max Units Conditions Clock frequency FCLK — — — 100 100 400 kHz 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Clock high time THIGH 4000 4000 600 — — — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.
PAGE 4
24AA00/24LC00/24C00 2.0 PIN DESCRIPTIONS 2.1 SDA Serial Data 4.0 BUS CHARACTERISTICS The following bus protocol has been defined: This is a bidirectional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). • Data transfer may be initiated only when the bus is not busy.
PAGE 5
24AA00/24LC00/24C00 4.5 Acknowledge The device that acknowledges has to pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave.
PAGE 6
24AA00/24LC00/24C00 5.0 DEVICE ADDRESSING After generating a Start condition, the bus master transmits a control byte consisting of a slave address and a Read/Write bit that indicates what type of operation is to be performed. The slave address for the 24XX00 consists of a 4-bit device code ‘1010’ followed by three “don’t care” bits. The last bit of the control byte determines the operation to be performed.
PAGE 7
24AA00/24LC00/24C00 7.0 ACKNOWLEDGE POLLING FIGURE 7-1: Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately.
PAGE 8
24AA00/24LC00/24C00 8.0 READ OPERATIONS Read operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to one. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24XX00 contains an address counter that maintains the address of the last word accessed, internally incremented by one.
PAGE 9
24AA00/24LC00/24C00 FIGURE 8-2: RANDOM READ S T BUS ACTIVITY A MASTER R Control Byte S T A R T Word Address(n) T S 10 10xxx 0 SDA LINE x xxx P A C K BUS ACTIVITY MASTER N O A C K x = “don’t care” bit FIGURE 8-3: S T O P Data (n) S 10 10xxx 1 A C K A C K BUS ACTIVITY Control Byte SEQUENTIAL READ Control Byte Data n Data n + 1 Data n + 2 S T O P Data n + x P SDA LINE BUS ACTIVITY A C K © 2007 Microchip Technology Inc.
PAGE 10
24AA00/24LC00/24C00 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24LC00 I/P e3 13F 0527 Example: 24LC00I SN e3 0527 13F Example: XXXX 4L00 TYWW I527 NNN 13F 8-Lead 2x3 DFN XXX YWW NN Example: 204 527 13 5-Lead SOT-23 Example: XXNN M03F DS21178G-page 10 © 2007 Microchip Technology Inc.
PAGE 11
24AA00/24LC00/24C00 1st Line Marking Codes Part Number SOT-23 DFN TSSOP I Temp. E Temp. I Temp. E Temp. 4A00 B0NN — 201 — 24LC00 4L00 M0NN — 204 — 24C00 4C00 D0NN E0NN 207 208 24AA00 Note: NN = Alphanumeric traceability code Legend: XX...
PAGE 12
24AA00/24LC00/24C00 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 8 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .
PAGE 13
24AA00/24LC00/24C00 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e N E E1 NOTE 1 1 2 3 α h b h A2 A c φ L A1 L1 Units Dimension Limits Number of Pins β MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 1.25 – – Standoff § A1 0.10 – 0.
PAGE 14
24AA00/24LC00/24C00 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 0.65 BSC – Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 – 0.15 1.
PAGE 15
24AA00/24LC00/24C00 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e b N N L K E2 E EXPOSED PAD NOTE 1 2 1 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.
PAGE 16
24AA00/24LC00/24C00 5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN NOM MAX N 5 Lead Pitch e 0.95 BSC Outside Lead Pitch e1 Overall Height A 0.90 – Molded Package Thickness A2 0.89 – 1.30 Standoff A1 0.00 – 0.
PAGE 17
24AA00/24LC00/24C00 APPENDIX A: REVISION HISTORY Revision E Added DFN package. Revision F (02/2007) Revised Device Selection Table; Features Section; Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2; Revised Product ID System; Replaced Package Drawings; Replaced On-line Support page. Revision G (03/2007) Replaced Package Drawings (Rev. AM). © 2007 Microchip Technology Inc.
PAGE 19
24AA00/24LC00/24C00 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
PAGE 20
24AA00/24LC00/24C00 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 21
24AA00/24LC00/24C00 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. X PART NO. Device /XX Temperature Package Range Examples: a) b) Device: 24AA00: 24AA00T: 24LC00: 24LC00T: 24C00: 24C00T: Temperature I Range: E Package: P SN ST OT MC = 1.7V, 128 bit I2C™ Serial EEPROM = 1.7V, 128 bit I2C Serial EEPROM (Tape and Reel) = 2.5V, 128 bit I2C Serial EEPROM = 2.
PAGE 23
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 24
WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.