Datasheet

2012-2013 Microchip Technology Inc. DS20005142B-page 29
23A1024/23LC1024
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not all possible ordering options
are shown below.
.
PART NO. X /XX
PackageTape & Reel
Device
Device: 23A1024 =
23LC1024 =
1 Mbit, 1.7 - 2.2V, SPI Serial SRAM
1 Mbit, 2.5 - 5.5V, SPI Serial SRAM
Tape & Reel: Blank =
T=
Standard packaging (tube)
Ta p e & Ree l
Temperature
Range:
I=
E=
-40C to +85C
-40C to +125C
Package: SN =
ST =
P=
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic PDIP (300 mil body), 8-lead
Examples:
a) 23A1024-I/ST = 1 Mbit, 1.7-2.2V Serial SRAM,
Industrial temp., TSSOP package
b) 23LC1024T-I/SN = 1 Mbit, 2.5-5.5V Serial
SRAM, Industrial temp., Tape & Reel, SOIC
package
c) 23LC1024-I/P = 1 Mbit, 2.5-5.5V Serial SRAM,
Industrial temp., PDIP package
d) 23A1024-E/ST = 1 Mbit, 1.7-2.2V Serial
SRAM, Extended temp., TSSOP package
e) 23LC1024T-E/SN = 1 Mbit, 2.5-5.5V Serial
SRAM, Extended temp., Tape & Reel, SOIC
package
f) 23LC1024-E/P = 1 Mbit, 2.5-5.5V Serial
SRAM, Extended temp., PDIP package
X
Temp Range