Specifications

COMPONENT FOCUS
4
www.futureelectronics.com
FAX
[phone]
EMAIL
ftm.asia
@
futureelectronics.com
Reader Response No.
5
IR Introduces the IRF6708S2 and IRF6728M DirectFET® MOSFET
Chipset Tailored for Cost Sensitive DC-DC Applications
FAX
[phone]
EMAIL
ftm.asia
@
futureelectronics.com
Reader Response No.
4
International Rectier, IR® introduced the
IRF6708S2 and IRF6728M 30V DirectFET®
MOSFET chipset tailored for cost sensitive 19V
input synchronous buck applications such as
notebooks.
The IRF6708S2 Small Can and IRF6728M
Medium Can devices reduce component
count by 30 percent to drastically reduce
overall system cost. The new DirectFET
MOSFETs feature low charge and on-state
resistance RDS(on) to minimize conduction
and switching losses. The IRF6728M also
features a monolithically integrated Schottky
that reduces losses associated with body diode
conduction and reverse recovery.
International
Rectier
Part Number
BVDSS
(V)
RDS(on) typ
@10V
(mOhms)
RDS(on) typ
@4.5V
(mOhms)
VGS
(V)
QG typ @4.5V
(nC)
QGD typ @4.5V
(nC)
IRF6728M 30 1.8 2.8 +/-20 28 8.7
IRF6708S2 30 7.5 12.0 +/-20 6.6 2.2
FEATURES:
 PESDxLD:
 •Lowclampingvoltage
 •30kVESDprotection
 •Highpeakpulsepower
 •Lowleakagecurrent
 BAS16LD:
 •4nsreverse-recoverytime
 •215mAforwardcurrent
 •0.5μAreversecurrent
 •1.5pFdiodecapacitance
APPLICATIONS:
 Computers and peripherals
 Communication systems
 Networking equipment
 Audio and video equipment
 Portable electronics
Key Specifications
The IRF6708S2 and IRF6728M feature IR’s
latest generation 30V MOSFET silicon. In
addition to low RDS(on) and charge, the new
devices leverage the low parasitic resistance
inductance and superior cooling ability of the
DirectFET package.
NXP
Semiconductors
Package innovation allows easy visual solder inspection with highly
robust soldering
The NXP Semiconductors PESDxLD
ESDprotection diodes and BAS16LD
100V single high-speed switching diode
are the rst products in the market to
take advantage of NXP’s innovative
SOD882D leadless package,
which oers enhanced
mechanical properties
and easy visual
inspection at a very
low package height of
only 0.37mm.
The SOD882D is the
industry’s rst leadless two-
pin package to feature bottom
pads that are also exposed and tin
plated on the sides thereby allowing soldering
of the side pads. This innovative pad design
allows easy visual solder inspection and high
solder-joint strength to withstand shear forces
and board bending. The thermal, electrical
and mounting characteristics, and the 1.0mm
x 0.6mm footprint, are compatible with other
1006 (0402) packages. With a height of only
0.37mm, the SOD882D is also one of the
attest packages in this form factor.
The ESD-protection diodes released in
the new package are the PESD5V0V1BLD,
PESD5V0S1BLD, PESD5V0S1ULD and
PESD24V0S1ULD, providing a choice of 5V or
24V stando voltages. These are single-
channel, bidirectional devices
meeting the IEC 61000-4-2
specications for ESD
and surge protection.
The BAS16LD high-
speed switching diode
is optimised for fast
switching speed, low
capacitace and low
leakage current. All the devices
are qualied to AEC-Q101 for use in
automotive applications.