Datasheet
Small multi 6 -8 leaded SOIC components, as well as small resistor networks are ideal, but the maximum
size recommended is 5mm square
,
If there are these smaller components adjacent to temperature sensitive devices, the HCT2-200 can be
employed, since there is high degree of controllability of the hot air due to the precision that the nozzle
allows.
Applications that will require additional aids when using the HCT2-200
Teledyne Solid-state power controller (SSPC) - 2 - 10 A, 28 V DC | SSPCB04028 series
General guidelines are that if the components are attached to major ground or power planes, or the
board thickness and densities are greater, the device may need a preheater to help in the solder
liquefaction process. The circuit card above (a power control module by Teledyne Microelectronics
i
)
that is capable of providing 10A current has a board density that would require a preheater to aid in the
solder liquefaction process. The board design is such that there are significant copper plane layers in
the board construction. This board construction aids in the heat transfer to the mounting points, but in
turn impedes the ability of the HCT2-200’s ability to reflow solder.