Datasheet

HCT2-200
Product capabilities and usages
The HCT2-120 was developed for small component sizes and low board
densities. The low airflow relative to the existing components was purposeful to prevent the air from
blowing the smaller components off of the Printed Circuit Card Assemblies (PCBAs) during either
removal or installation. This design feature can seriously impact the heat transfer to the solder,
resulting in a perception that the product is not working properly. We have run a series of available
circuit card assemblies and timed the ability to reach removal temperature to aid the Sales group in
identifying the appropriate applications to sell the HCT2-120 into (attachment A).
This design approach also means that there are limitations in where the product may be used
successfully without additional aids (such as a preheater). General guidance is that the product is good
for ≤4 layer PCBAs that have ≤1oz copper traces. The board density will play a larger factor in the
success, as the higher the component/sq.-in, the more heat diffusion results, requiring additional time
or variability in the process. As the board thickness increases, copper density increases, or the
component density increases, the need for additional aids increase in being successful in component
removal/reflow.
Some guidance for general usage is:
Removal and soldering of small
components close to plastic
components that would melt with
larger hot air tools is an ideal
application for the HCT2- 120 as
airflow is controlled to a lower flow
rate for small components