User's Manual

9
1. Introduction
This document describes the hardware application interface of the module, including the circuit
connections and RF interfaces of the relevant applications. It can help users quickly understand the
module's interface definition, electrical performance and structural size details. Combined with this
and other application documents, users can quickly use modules to design mobile communication
applications.
2. Module Overview
The SLM756P module uses the Qualcomm MSM8909 platform solution, the MSM8909 processor
is manufactured in a 28nm LP CMOS process, the quad core clocked at 1.1GHz, and the memory
supports 8GB+1GB (compatible with 16GB+2GB) LPDDR3. The chip can support WCDMA,
FDD-LTE and other standards, and is a highly integrated product.
The working frequency bands that the SLM756P module can support are:
 FDD-LTE: B2/4/5/7/12/13/17
 WCDMA: B2/4/5
The physical interface of the module is a 210-pin pad that provides the following hardware interfaces:
 Two serial ports, including one four-wire serial port and one two-wire serial port.
 LCM (MIPI interface).
 Two-way Camera interface (MIPI data).
 A high-speed USB interface.
 Three audio input interfaces.
 Three-channel audio output interface.
 Two-way UIM card interface.
 GPIO interface.
 Four sets of I2C interfaces.
 A set of SPI interfaces.
 A TF card interface.
 Support GNSS, WiFi, Bluetooth4.1, FM function.
2.1 Summary of features
Table 2.1：SLM756P features
Product characteristics
Description
Plateform
Qualcomm MSM8909
CPU
Quad-core A7 (32bit) 1.1GHz