User's Manual

MeiG hardware design guide
42
degrees and relative humidity <90%, the shelf life is at least 6 months without unpacking. After
unpacking, Table 22 lists the shelf life of the modules for different moisture sensitivity levels.
Table 7.1: Humidity sensitivity level distinction
Grade
Factory environment≦+30℃/60%RH
1
Indefinite quality in the environment≦+30℃/85% RH Under conditions
2
1 Year
2a
4 Weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Use it after forced baking. After baking, the module must be patched within the
time limit specified on the label.
After unpacking, the SMT patch should be performed within 168 hours under ambient conditions of
<30 degrees and relative humidity <60%. If the above conditions are not met, baking is required. Note:
Oxidation risk: Baking SMD packages can cause metal oxidation and, if excessive, can cause
solderability problems during board assembly. The temperature and time of the SMD package are
baked, thus limiting solderability considerations. The accumulation of baking time should be no more
than 96 hours at temperatures above 90 ° C and as high as 125 ° C.
7.4. Baking Requirements
The MEIG Smart Module has a moisture rating of three. The SLM756P should be fully baked before
reflow soldering, otherwise the module may cause permanent damage during reflow. The SLM756P
can use the following three baking conditions. Users should note that the tray is not resistant to high
temperatures. The user should take the module out of the tray for baking, otherwise the tray may be
damaged by high temperature.
Table 7.2: Baking requirements:
Baking condition
40°/5%RH
60°/5%RH
90°/5%RH
Baking time
30 Days
72 Hours
48Hours
Description
Original tray can be used
Original tray can be used
Original tray cannot be
used
8. Support Peripheral Device List
Table 8.1: List of supported display models
Vendor
Drive IC