User's Manual

MeiG hardware design guide
41
7. Production
7.1. Top And Bottom Views Of The Module
Figure 48: Module top and bottom views
7.2. Recommended Soldering Furnace Temperature Curve
Figure 49: Module recommended soldering furnace temperature curve
7.3. Humidity Sensitivity (MSL)
The SLM756P module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-
020C specification in accordance with the IPC/JEDEC standard under ambient conditions of <30
degrees of temperature and <60% of relative humidity. Under ambient conditions of temperature <40