Users Manual
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at least 6 months without unpacking. After unpacking, Table 22 lists the shelf life of the modules for different
moisture sensitivity levels.
Table 7.1: Humidity sensitivity level distinction
Grade
Factory environmenti +30h /60%RH
1
Indefinite quality in the environmenti +30h /85% RH Under conditions
2 1 Year
2a 4 Weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6
Use it after forced baking. After baking, the module must be patched within the
time limit specified on the label.
After unpacking, the SMT patch should be performed within 168 hours under ambient conditions of <30 degrees
and relative humidity <60%. If the above conditions are not met, baking is required. Note: Oxidation risk: Baking
SMD packages can cause metal oxidation and, if excessive, can cause solderability problems during board assembly.
The temperature and time of the SMD package are baked, thus limiting solderability considerations. The
accumulation of baking time should be no more than 96 hours at temperatures above 90 ° C and as high as 125 ° C.
(5(01A%#
The MEIG Smart Module has a moisture rating of three. The SLM756 should be fully baked before reflow soldering,
otherwise the module may cause permanent damage during reflow. The SLM756 can use the following three baking
conditions. Users should note that the tray is not resistant to high temperatures. The user should take the module
out of the tray for baking, otherwise the tray may be damaged by high temperature.
Table 7.2: Baking requirements:
Baking condition
40!/5%RH 60!/5%RH 90!/5%RH
Baking time 30 Days 72 Hours 48Hours
Description Original tray can be used Original tray can be used
Original tray cannot be
used
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