Users Manual
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51
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Figure 48: Module top and bottom views
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Figure 49: Module recommended soldering furnace temperature curve
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The SLM756 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-020C specification
in accordance with the IPC/JEDEC standard under ambient conditions of <30 degrees of temperature and <60% of
relative humidity. Under ambient conditions of temperature <40 degrees and relative humidity <90%, the shelf life is
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