Users Manual
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3 The standard of the headphone interface is the European standard OMPT. If you need to design the American
standard CTIA interface, you need to swap the GND and MIC signals for the network. If you want to be compatible
with both headset standards, you need an external dedicated chip, such as the TI-TS3A226AE.
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The module integrates a Class-D audio amplifier with an output power of 0.85W and an output signal
of
SPKR_OUT_P / SPKR_OUT_M
Figure 4.24: Recommended Circuit with Internal Audio Power Amplifier
It is also possible to add an audio amplifier externally, using CDC_HPH_R as a single-ended input signal, and the
reference circuit is shown below.
Figure 4.25: Recommended Circuit with External Audio Power Amplifier
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There is a set of GPIO-compatible I2S interfaces inside the module. The pins used by this function are as follows:
Name Pin Input/Output Description
%.54 89 .
I2S1 input DATA
%.56 91 5
I2S1 output DATA
%.5- 9- 5
I2S1_ SCK
%.51 96 5
I2S1_ WS
0HL*KDUGZDUHGHVLJQJXLGH