Specifications

LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-C Preliminary Handling and soldering
Page 66 of 75
To avoid falling off, LEON-G100/G200 modules should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Preheat
0
50
100 150 200 250 300
50
100
150
200
250
Heating Cooling
50
100
150
200
250
max 1- 4 °C/s
max 60 - 120 s
Peak Temp.
230 - 250 °C
Liquidus Temperature
216 - 221
[°C]
Elapsed Time [s]
max 20 - 40 s
Typical Leadfree
Soldering Profile
End Temp.
150 - 200 °C
max 3 °C/s
[°C]
Figure 47: Recommended soldering profile
When soldering lead-free (LEON-G100/G200) modules in a leaded process, check the following
temperatures:
PB- Technology Soaktime: 40-80 sec
Time above Liquidus: 40-90 sec
Peak temperature: 225-235°C
LEON-G100/G200 modules must not be soldered with a damp heat process.
3.2.3 Optical inspection
After soldering the LEON-G100/G200 module, inspect the modules optically to verify that he module is properly
aligned and centered.
3.2.4 Cleaning
Cleaning the soldered modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard
and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits
or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-
jet printed text.
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two
housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker
and the ink-jet printed text.
Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.