Specifications

LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-C Preliminary Design-In
Page 59 of 75
Figure 38: Ground copper and signal keep-out below data module on application motherboard due to due to VCC area, RF ANT
pin and exposed GND pad on data module bottom layer
Figure 39: Signals keep-out below data module on application motherboard due to GND opening on data module bottom layer
for internal RF signals
Routing below LEON-G100/G200 on application motherboard is generally possible but not recommended: in
addition to the required keep-out defined before, consider that the insulation offered by the solder mask
painting may be weakened corresponding to micro-vias on LEON-G100/G200 bottom layer, thus increasing the
risk of short to GND if the application motherboard has unprotected signal routing on same coordinates.