locate, communicate, accelerate LEON-G100/G200 Quad Band GSM/GPRS Voice and Data Modules System Integration Manual Abstract This document describes the features and integration of the LEON-G100/G200 Quad Band GSM/GPRS data and voice modules. The LEON-G100/G200 are complete and cost efficient solutions, bringing full feature Quad Band GSM/GPRS data and voice transmission technology in a compact form factor. 29.5 x 18.9 x 2.84 mm www.u-blox.
LEON-G100/G200 - System Integration Manual Document Information Title LEON-G100/G200 Subtitle Quad Band GSM/GPRS Voice and Data Modules Document type System Integration Manual Document number GSM.G1-HW-09002-C Document status Preliminary This document contains preliminary data, revised and supplementary data may be published later. This document applies to the following products: Name Type number Firmware version PCN reference LEON-G100 LEON-G200 LEON-G100-00S-01 LEON-G200-00S-00 07.30 07.
LEON-G100/G200 - System Integration Manual Preface u-blox Technical Documentation As part of our commitment to customer support, u-blox maintains an extensive volume of technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development.
LEON-G100/G200 - System Integration Manual Clear description of your question or the problem A short description of the application Your complete contact details GSM.
LEON-G100/G200 - System Integration Manual Contents Preface ................................................................................................................................ 3 Contents.............................................................................................................................. 5 1 System description ....................................................................................................... 8 1.1 1.2 Overview .....................................
LEON-G100/G200 - System Integration Manual 2.3 2.4 3 2.4.1 Antenna termination ................................................................................................................... 61 2.4.2 2.4.3 Antenna radiation ....................................................................................................................... 62 Antenna detection functionality ..................................................................................................
LEON-G100/G200 - System Integration Manual Contact .............................................................................................................................. 75 GSM.
LEON-G100/G200 - System Integration Manual 1 System description 1.1 Overview LEON-G100/G200 GSM/GPRS modules integrate a full-featured Release 99 GSM-GPRS protocol stack, with the following main characteristics.
LEON-G100/G200 - System Integration Manual 1.2 Architecture 32.768 kHz 26 MHz Power-On PA ANT External Reset RF Transceiver SAW Filter Switch GPIO DDC (for GPS) SIM Card Memory UART Baseband 2 Analog Audio Vcc (Supply) Power Management Headset Detection V_BCKP ADC Figure 1: LEON-G100 Block Diagram 32.
LEON-G100/G200 - System Integration Manual 1.2.1 Functional blocks The LEON-G100/G200 modules consist of the following functional blocks: RF Baseband Power Management 1.2.1.1 RF The RF block is composed of the following main elements: RF transceiver (integrated in the GSM/GPRS single chip) performing modulation, up-conversion of the baseband I/Q signals, down-conversion and demodulation of the RF received signals.
LEON-G100/G200 - System Integration Manual ADC input is provided on the LEON-G100 module only GSM.
LEON-G100/G200 - System Integration Manual 1.3 Pin-out Table 1 describes the pin-out of LEON-G100/G200 modules, with pins grouped by function. Function Pin No I/O Description Remarks Power VCC 50 I Module Supply GND 1, 3, 6, 7, 8, 17, 25, 36, 45, 46, 48, 49 N/A Ground Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range.
LEON-G100/G200 - System Integration Manual Function Pin No I/O Description Remarks Audio pin: see section 1.9.1 MIC_GND2 42 I MIC_GND1 43 I MIC_BIAS1 44 SIM_CLK Second microphone analog reference First microphone analog reference Local ground of second microphone. Audio pin: see section 1.9.1 Local ground of the first microphone. Audio pin: see section 1.9.1 I First microphone analog bias Single ended supply output and signal input for first microphone.
LEON-G100/G200 - System Integration Manual 1.4 Operating Modes LEON-G100/G200 modules include several operating modes, each have different active features and interfaces. Table 2 summarizes the various operating modes and provides general guidelines for operation. General Status Operating Mode Description Features / Remarks Power-down Not-Powered Mode VCC supply not present or below normal operating range. Microprocessor not operating. RTC only operates if supplied through V_BCKP pin.
LEON-G100/G200 - System Integration Manual General Status Charging (LEON-G200 only) Operating Mode Description Connected-Mode Voice or data call enabled. Microprocessor runs with 26 MHz as reference oscillator. Module is prepared to accept data signals from an external device. Pre-charge mode Battery connected to VCC. Battery voltage level is below the VCC normal operating range. Charger connected to V_CHARGE and CHARGE_SENSE inputs with proper voltage and current characteristics.
LEON-G100/G200 - System Integration Manual 1.5 Power management 1.5.1 Power supply circuit overview LEON-G100/G200 4-Bands GSM FEM Antenna Switch PA GSM/GPRS Chipset Charging Control VCC LDOs RF LDOs BB 50 47 µF MCP Memory EBU LDO NOR Flash PSRAM LDO LDO V_BCKP RTC 2 1 µF VSIM 35 1 µF Figure 3: Power supply concept LEON G100 / LEON-G200 modules are supplied via the VCC pin. There is only one main power supply pin.
LEON-G100/G200 - System Integration Manual Collecting and processing of measurements of battery voltage 1.5.2 Voltage supply (VCC) LEON G100 / LEON-G200 modules must be supplied through the VCC pin by a DC power supply. Voltages must be stable, due to the surging consumption profile of the GSM system (described in the section 1.5.2.1).
LEON-G100/G200 - System Integration Manual Voltage overshoot ripple 3.8 V (typ) drop ripple RX slot unused unused slot slot TX slot undershoot unused unused slot slot MON slot unused slot RX slot unused unused slot slot GSM frame 4.615 ms (1 frame = 8 slots) Figure 4: Description of the VCC voltage profile versus time during a GSM call TX slot unused unused slot slot MON slot unused slot Time GSM frame 4.615 ms (1 frame = 8 slots) To reduce voltage drops, use a low impedance power source.
LEON-G100/G200 - System Integration Manual Reference Description Part Number - Manufacturer C37 330 µF Capacitor Tantalum D_SIZE 6.
LEON-G100/G200 - System Integration Manual Current 2500 mA Depends on TX power 200 mA RX slot unused unused slot slot TX slot ~170 mA unused unused slot slot MON slot ~170 mA unused slot RX slot ~40 mA unused unused slot slot GSM frame 4.615 ms (1 frame = 8 slots) TX slot unused unused slot slot GSM frame 4.
LEON-G100/G200 - System Integration Manual ~150 mA 500-700 uA 0.44-2.09 s ~30 ms IDLE MODE ACTIVE MODE ~150 mA 20-22 mA 8-10 mA 500-700 uA Active Mode Enabled RX+DSP Enabled PLL Enabled IDLE MODE Idle Mode Enabled ~30 ms ACTIVE MODE IDLE MODE Figure 7: Description of the VCC current consumption profile versus time when the module is registered with the network: the module is in idle mode and periodically wakes up to active mode to monitor the paging channel for paging block reception 1.5.
LEON-G100/G200 - System Integration Manual LEON-G200 5 CHARGE_SENSE 4 V_CHARGE Charger voltage and current limited GND 50 VCC Li-Ion Battery 500 mAh … 1100 mAh GND Figure 9: Connection of an external DC supply used as charger and a Li-Ion battery to the LEON-G200 module Figure 8: Connection of an external DC supply used as charger and a Li-Ion battery to the LEON-G200 module When charger detection is implemented: a valid charger is recognized if the voltage provided to V_CHARGE and CHARGE_SENSE pi
LEON-G100/G200 - System Integration Manual of >99% of a period. The remaining off time is used to check if the AC-DC wall adapter is still connected since detection is critical when charging switch is closed.
LEON-G100/G200 - System Integration Manual the maximum acceptable charging current (equal to the capacity value of the used battery plus 100 mA) the minimum charging current (specified by the application, e.g. 400 mA) For example, Figure 10 and Figure 11 show the valid area for the charger V-I output characteristics using a 500 mAh Li-Ion battery (Figure 10) and a 1100 mAh Li-Ion battery (Figure 11). V Charger specification using a 500 mAh Li-Ion Battery 16 15.0 14 13 12 11 10 9 8 7 5.
LEON-G100/G200 - System Integration Manual V Charger specification using a 1100 mAh Li-Ion Battery 16 15.0 14 13 12 11 10 9 8 7 5.6 6 5 4 3 2 1 0 0 100 200 300 500 600 700 800 900 1000 1100 400 1300 mA 1200 Figure 11: Valid area for the charger V-I output characteristics using a 1100 mAh Li-Ion Battery 1.5.4 Voltage Backup Power (V_BCKP) The V_BCKP pin connects the Real Time Clock (RTC) supply, which is internally generated by a linear regulator integrated in the module chipset.
LEON-G100/G200 - System Integration Manual the V_BCKP voltage within its valid range for around 10 hours at 25°C, after the VCC supply is removed. These capacitors will let the time reference run during a disconnection of the battery. LEON-G100/G200 100 µF GRM43SR60J107M 2 + V_BCKP LEON-G100/G200 4.
LEON-G100/G200 - System Integration Manual on the application board, in range from 1.8 V to 3.3 V. It should also be available when the module is in poweroff mode. Other possibility is to use a push-pull output of the external device, but take care to fix the proper level in all the possible scenarios to avoid an inappropriate switch-on of the module.
LEON-G100/G200 - System Integration Manual The power-on sequence is described in Figure 14. Valid VCC Start-up event VCC V_BCKP PWR_ON don't care don't care LDOs RESET_N System State BB Pads State OFF Tristate ON Reset Operational Figure 14: Power on sequence description 1.6.2 Module power off LEON-G100/G200 can be switched-off by one of the following switch-off events: Via AT command AT+CPWROFF (more details in u-blox AT Commands Manual [2]). This is the only way to switch off the module.
LEON-G100/G200 - System Integration Manual Turn-off triggered VCC V_BCKP LDOs RESET_N System State ON OFF BB Pads State Operational Tristate Figure 15: Power off sequence description 1.6.3 Module reset Reset the module using RESET_N: this performs an external or hardware reset. When RESET_N pin is driven to low, the device is initialized into a defined reset state. An asynchronous reset of the entire module - except for the RTC - is triggered.
LEON-G100/G200 - System Integration Manual LEON-G100/G200 Reset push button RESET_N 12.6 k 1.88 V 22 Application Processor LEON-G100/G200 12.6 k RESET_N 22 1.88 V Figure 16: Application circuits to reset the module using a push button or using an application processor When the module is in power-off mode or in reset state, RESET_N is pulled low (e.g. during boot sequence, a watchdog timer, or software reset).
LEON-G100/G200 - System Integration Manual 1.7 RF connection The core of the RF part of the LEON-G100/G200 modules is the transceiver integrated in the GSM/GPRS single chip. The integrated receiver covers the four GSM bands GSM850 MHz, EGSM900 MHz, DCS1800 MHz and PCS1900 MHz, using two LNAs integrated in the RF Transceiver and providing quad-band operation.
LEON-G100/G200 - System Integration Manual Second microphone input: direct connection of an electret condenser microphone, used in the headset mode Two speaker outputs: First speaker output: a single ended low power audio output, can be used to directly connect a receiver (earpiece) used in handset mode or in headset mode Second speaker output: a differential high power audio output, can be used to directly connect a speaker or a loud speaker used in ring-tones or in hands-free mode Headset detection input
LEON-G100/G200 - System Integration Manual Name Description Remarks HS_P Low power single-ended analog audio output Used in handset or in headset mode SPK_P SPK_N High power differential analog audio output High power differential analog audio output Used in ring tones or in hands free mode Used in ring tones or in hands free mode MIC_BIAS2 Second microphone analog bias MIC_GND2 Second microphone analog reference Single ended supply output and signal input for the second microphone.
LEON-G100/G200 - System Integration Manual Audio Device LEON-G100/G200 10 µF HS_P 37 Single-ended Analog Input Reference GND 10 µF MIC_BIAS1 44 Single-ended Analog Output MIC_GND1 43 Reference Audio Device LEON-G100/G200 10 µF HS_P 37 Single-ended to Differential 10 µF MIC_GND1 Negative Analog Input Reference GND MIC_BIAS1 Positive Analog Input 44 Differential to Single-ended 43 Positive Analog Output Negative Analog Output Reference Figure 20: Application circuits to connect the L
LEON-G100/G200 - System Integration Manual Mount a 33 nH series inductor (e.g. Murata LQP15M33NG02) on each microphone line, and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and the TDMA noise LEON-G100/G200 MIC_GND2 42 MIC_BIAS2 41 HS_P 37 HS_DET 18 Figure 21: Headset connector application circuit 1.9.1.
LEON-G100/G200 - System Integration Manual LEON-G100/G200 SPK_P 38 SPK_N 39 MIC_BIAS1 44 MIC_GND1 43 Figure 22: Hands free mode application circuit 1.9.1.6 Connection to an external analog audio device When the LEON-G100/G200 module analog audio output is connected to an external audio device, HS_P analog audio output can be used. A 10 µF series capacitor (e.g.
LEON-G100/G200 - System Integration Manual Audio Device LEON-G100/G200 10 µF HS_P 37 Single-ended Analog Input Reference GND 10 µF MIC_BIAS1 44 Single-ended Analog Output MIC_GND1 43 Reference Audio Device LEON-G100/G200 10 µF HS_P 37 Positive Analog Input Single-ended to Differential Negative Analog Input Reference GND 10 µF MIC_BIAS1 MIC_GND1 44 Positive Analog Output Differential to Single-ended Negative Analog Output 43 Reference Figure 23: Application circuits to connect the
LEON-G100/G200 - System Integration Manual If the I2S interface is used in PCM mode, digital path parameters can be configured and saved as the normal analog paths, using appropriate path index as described in the u-blox AT commands manual [2]. Analog gain parameters of microphone and speakers are unused when digital path is selected.
LEON-G100/G200 - System Integration Manual I2S_TX word can be written while I2S_WA is high, low or both; MSB can be 1 bit delayed or non-delayed on I2S_WA edge; I2S_TX data can change on rising or falling edge of I2S_CLK signal (Rising edge in this example); I2S_RX data read on the opposite front of I2S_CLK signal. 1.9.3 Voiceband processing system Digital voiceband processing on the LEON-G100/G200 is implemented in the DSP core inside the baseband chipset.
LEON-G100/G200 - System Integration Manual The sample-based voiceband processing is done on an interrupt level and its main task is to transfer the voiceband samples from either analog audio front-end TX path or I2Sx RX path to the Voiceband Sample Buffer and from the Voiceband Sample Buffer to the analog audio front-end RX path and/or I2Sx TX path.
LEON-G100/G200 - System Integration Manual 1.10 SIM interface An SIM card interface is provided on the board-to-board pins of the module: the high-speed SIM/ME interface is implemented as well as automatic detection of the required SIM supporting voltage. Both 1.8 V and 3 V SIM types are supported: activation and deactivation with automatic voltage switch from 1.8 to 3 V is implemented, according to ISO-IEC 78-16-e specifications.
LEON-G100/G200 - System Integration Manual 1.10.1 SIM functionality The following SIM services are supported: Abbreviated Dialing Numbers (ADN) Fixed Dialing Numbers (FDN) Last Dialed Numbers (LDN) Service Dialing Numbers (SDN) SIM Toolkit R99 is supported. 1.11 Serial Communication 1.11.
LEON-G100/G200 - System Integration Manual All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [2]): hardware flow control (RTS/CTS), software flow control(XON/XOFF), or none flow control. Autobauding is supported and can be enabled or disabled by an AT command (see u-blox AT Commands Manual [2]). Autobauding is enabled by default. Hardware flow control is default.
LEON-G100/G200 - System Integration Manual 1.11.1.2 UART signal behavior See Table 2 for a description of operating modes and states referred to in this section. By default the RxD and the TxD lines are set to the OFF state at UART initialization, following the boot sequence when the module is switched on. The module holds RxD and TxD in the OFF state until data is either transmitted or received by the module: an active pull-up is enabled inside the module on the TxD input.
LEON-G100/G200 - System Integration Manual The DTR line is set by default to the OFF state at the UART initialization, at the end of the boot sequence after the module switch on. The DTR line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the DTR input. By default the RI and the DCD lines are set to the OFF state at UART initialization, at the end of the boot sequence.
LEON-G100/G200 - System Integration Manual Application Processor (DTE) LEON-G100/G200 (DCE) TxD 15 TxD RxD 16 RxD RTS 13 RTS CTS 14 CTS DTR 12 DTR DSR 9 DSR RI 10 RI DCD 11 DCD V Fig. 30: UART interface application circuit with complete V.24 link in the DTE/DCE serial communication Using TxD, RxD, RTS and CTS lines (not using the complete V.24 link) Follow the application circuit described in Figure 31. In this case the HW flow-control is used.
LEON-G100/G200 - System Integration Manual because the module needs RTS active (low electrical level) and CTS is active (low electrical level) when the module is in active mode and the UART interface is enabled. In the application circuit a loop from the module DSR output line to the module DTR input line is provided because the module needs DTR active (low electrical level) and DSR is active (low electrical level) once the module is switched on and the UART interface is enabled.
LEON-G100/G200 - System Integration Manual 2 To be complaint with the I C bus specifications, the module pads of the bus interface are open drain output and pull up resistors must be used. Since the pull-up resistors are not mounted on the module, they must be 2 mounted externally. Resistor values must conform to the I C bus specifications [10].
LEON-G100/G200 - System Integration Manual LEON-G100 Rsig ADC1 5 G gADC Req Usig Uadc Ueq Figure 34: Equivalent network for ADC single-ended measurement The LEON-G100 ADC software driver takes care of the parameters shown in Figure 34 (Req, Ueq, G, gADC). The voltage measured by the ADC is Uadc. If the voltage source (Usig) has a significant internal resistance (Rsig) compared to the input resistance in measurement mode (Req) of the ADC, this should be taken into account and corrected.
LEON-G100/G200 - System Integration Manual 1.14 Approvals 1.14.
LEON-G100/G200 - System Integration Manual 2 Design-In This section provides a design-in checklist. 2.1 Schematic design-in checklist The following are the most important points for a simple design-in check: VCC supply should be capable of delivering 2.5 A current bursts with low voltage drop. For debug purposes, add a test point on each I2S pin and on GPIO1 also if they are not used. VCC supply should be clean, with very low ripple and noise.
LEON-G100/G200 - System Integration Manual 2.2 Design Guidelines for Layout The following design guidelines must be met for optimal integration of LEON-G100/G200 modules on the final application board. 2.2.1 Layout guidelines per pin function This section groups the LEON-G100/G200 pins by signal function and provides a ranking of importance in layout design.
LEON-G100/G200 - System Integration Manual Rank Function 1st RF Antenna In/out 2nd DC Supply 3rd Analog Audio Pin(s) Layout Remarks ANT Very Important Design for 50 characteristic impedance. See section 2.2.1.1 VCC line should be wide and short. Route away from sensitive analog signals. See section 2.2.1.2 Avoid coupling with noisy signals See section 2.2.1.
LEON-G100/G200 - System Integration Manual The transmission line must be routed in a section of the PCB where minimal interference from noise sources can be expected Route ANT line far from other sensitive circuits as it is a source of electromagnetic interference Avoid coupling with VCC routing and analog Audio lines Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer Add GND vias around transmission line Ensure no other signals are routed parallel to transmi
LEON-G100/G200 - System Integration Manual The large current generates a magnetic field that is not well isolated by PCB ground layers and which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In this case route VCC away from other sensitive functional units The typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range.
LEON-G100/G200 - System Integration Manual SPK_P / SPK_N are high level balanced output. They are DC coupled and must be used with a speaker connected in bridge configuration. Route SPK_P / SPK_N as differential pair, to reduce differential noise pick-up.
LEON-G100/G200 - System Integration Manual 2.2.1.7 Digital pins External Reset (RESET_N): input for external reset, a logic low voltage will reset the module SIM Card Interface (VSIM, SIM_CLK, SIM_IO, SIM_RST): the SIM layout may be critical if the SIM card is placed far away from LEON-G100/G200 or in close vicinity of RF antenna. In the first case the long connection may radiate higher harmonic of digital data.
LEON-G100/G200 - System Integration Manual 2.2.2 Footprint and paste mask 1.0 mm [39. mil] 29.5 mm [1161 mil] 0.8mm [31.5 mil] Stencil: 200 m 1.1 mm [43 mil] 0.8 mm [31.5 mil] 0.6 mm [23.5 mil] 0.8 mm [31.5 mil] 17.6 mm [693 mil] 1.55 mm [61 mil] 18.9 mm [744 mil] 18.9 mm [744 mil] 22.7 mm [893.
LEON-G100/G200 - System Integration Manual Figure 38: Ground copper and signal keep-out below data module on application motherboard due to due to VCC area, RF ANT pin and exposed GND pad on data module bottom layer Figure 39: Signals keep-out below data module on application motherboard due to GND opening on data module bottom layer for internal RF signals Routing below LEON-G100/G200 on application motherboard is generally possible but not recommended: in addition to the required keep-out defined befor
LEON-G100/G200 - System Integration Manual 2.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. 2.3 Module thermal resistance The Case-to-Ambient thermal resistance (RC-A) of the module, with the LEON-G100/G200 mounted on a 130 x 110 x 1.6 mm FR4 PCB with a high coverage of copper (e.g. the EVK-G25H evaluation kit) in still air conditions is equal to 14°C/W.
LEON-G100/G200 - System Integration Manual For integration observe these recommendations: Ensure 50 Ω antenna termination, minimize the V.S.W.R. or return loss, as this will optimize the electrical performance of the module. See section 2.4.1 Select antenna with best radiating performance. See section 2.4.2 If a cable is used to connect the antenna radiating element to application board, select a short cable with minimum insertion loss.
LEON-G100/G200 - System Integration Manual Figure 41: |S11| sample measurement of a wideband antenna 2.4.2 Antenna radiation An indication of the radiated power by the antenna can be approximated by measuring the |S2\| from a target antenna to the measurement antenna, measured with a network analyzer using a wideband antenna. Measurements should be done at a fixed distance and orientation. Compare the results to measurements performed on a known good antenna. Figure 42 through 45 show measurement results.
LEON-G100/G200 - System Integration Manual Figure 42 and 43: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole and a penta-band internal antenna, if |S21| like in marker 3 area are similar the target antenna performances are good Figure 44 and 45: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole and a wideband commercial antenna, if |S21| like in marker 1/2 area are similar 5 dB better in the dipole case, so the wideband antenna radiation is considerably le
LEON-G100/G200 - System Integration Manual 2.4.3 Antenna detection functionality The internal antenna detect circuit is based on DC voltage measurement at ANT. The module may inject a known DC current on ANT pin, to do resistance measurement. To achieve good antenna detection functionality, use an RF antenna with built-in resistor from ANT signal to GND, or implement an equivalent solution with a circuit between the antenna cable connection and the radiating element as shown in Fig. 46.
LEON-G100/G200 - System Integration Manual 3 Handling and soldering 3.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels and tapes, Moisture Sensitivity levels (MSD), shipment and storage information, as well as drying for preconditioning see the LEON-G100/G200 Data Sheet [1]. 3.2 Processing 3.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place.
LEON-G100/G200 - System Integration Manual To avoid falling off, LEON-G100/G200 modules should be placed on the topside of the motherboard during soldering. The final soldering temperature chosen at the factory depends on additional external factors like choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering temperature in the recommended soldering profile may permanently damage the module. Preheat Heating [°C] Cooling [°C] Peak Temp.
LEON-G100/G200 - System Integration Manual 3.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LEON-G100/G200 module populated on it. The reason for this is the risk of the module falling off due to high weight in relation to the adhesive properties of the solder. 3.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components.
LEON-G100/G200 - System Integration Manual 4 Product Testing 4.1 u-blox in-series production test u-blox focuses on high quality for its products. To achieve a high standard it’s our philosophy to supply fully tested units. Therefore at the end of the production process, every unit is tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit.
LEON-G100/G200 - System Integration Manual Appendix A Extra Features A.1 Firmware (upgrade) Over AT (FOAT) Firmware upgrade is available with LEON-G100/G200 modules using AT commands. For more information see the Firmware (upgrade) Over AT (FOAT) Application Note [3]. A.1.1 Overview This feature allows upgrade the module Firmware over UART, using AT Commands.
LEON-G100/G200 - System Integration Manual A.5 HTTP HTTP client is implemented in LEON. HEAD, GET, POST, DELETE and PUT operations are available. The file size to be uploaded / downloaded depends on the free space available in the local file system (FFS) at the moment of the operation. Up to 4 HTTP client contexts to be used simultaneously. For more details about AT commands see the u-blox AT Commands Manual [2]. A.6 SMTP LEON supports SMTP client functionalities.
LEON-G100/G200 - System Integration Manual B Glossary 3GPP AC ADC ADN AMR ASIC AT BB CBCH CBS CLK CMOS CS CTS DAC DC DCD DCE DCS DDC DL DRX DSP DSR DTE DTR EBU EEP EGSM EMC EMI ESD ESR FAQ FDN FET FFS FIR FOAT FOTA FTP FW GND GPIO GPRS GPS GSM HDLC HTTP I/O I/Q I2C I2S IIR IP ISO ITU GSM.
LEON-G100/G200 - System Integration Manual LDN LDO LED LNA M2M ME MIDI MSB MSD MSL MUX NOM NTC OSI PA PBCCH PCCCH PC PCB PCM PCS PICS PIXIT PMU PPS PSRAM RF RI RoHS RTC RTS RX RXD SAR SAW SCL SDA SDN SIM SMA SMS SMTP STK SW TCH TCP TDMA TS TX TXD UART UDP UL VCO VSWR WA GSM.
LEON-G100/G200 - System Integration Manual Related documents [1] u-blox LEON-G100/G200 Data Sheet, Document No GSM.G1-HW-09001 [2] [3] u-blox AT Commands Manual, Document No GSM.G1-SW-09002 Firmware (upgrade) Over AT (FOAT) Application Note, Document No GSM.G1-CS-09005 (available after 11/09) [4] Firmware (upgrade) Over the Air (FOTA) Application Note, Document No GSM.G1-CS-09006 (available after 11/09) [5] GPS Integration Application Note, Document No GSM.
LEON-G100/G200 - System Integration Manual Revision history Revision Date Name Status / Comments - 30/04/2009 tgri Initial release. Objective specification A 22/06/2009 lpah New CI A1 16/07/2009 tgr Change of document status to advance information B 20/08/2009 lpah Figure 1.1 and Figure 1.2: corrected the LEON block diagram Figure 1.17: corrected the SIM Application circuit Document updated for serial port handling Table 1: renamed pins and description Chapter 1.11.
LEON-G100/G200 - System Integration Manual Contact For complete contact information visit us at www.u-blox.com u-blox Offices North, Central and South America u-blox America, Inc. Phone: +1 (703) 483 3180 E-mail: info_us@u-blox.com Regional Office West Coast: Phone: +1 (703) 483 3184 E-mail: info_us@u-blox.com Headquarters Europe, Middle East, Africa u-blox AG Phone: +41 44 722 74 44 E-mail: info@u-blox.com Support: support @u-blox.
