Datasheet

10-Bit, Nonvolatile, Linear-Taper Digital
Potentiometers
Chip Information
PROCESS: BiCMOS
PART CONFIGURATION
END-TO-END
RESISTANCE (kΩ)
MAX5481ETE Voltage-divider 10
MAX5481EUD Voltage-divider 10
MAX5482ETE Voltage-divider 50
MAX5482EUD Voltage-divider 50
MAX5483ETE Variable resistor 10
MAX5483EUD Variable resistor 10
MAX5484ETE Variable resistor 50
MAX5484EUD Variable resistor 50
Selector Guide
*SEE FUNCTIONAL DIAGRAM
14
13
12
11
10
9
8
1
2
3
4
5
6
7
V
SS
N.C.
H
WSCLK(INC)
CS
GND
V
DD
TOP VIEW
MAX5481*
MAX5482*
L
N.C.
N.C.N.C.
SPI/UD
DIN(U/D)
TSSOP
14
13
12
11
10
9
8
1
2
3
4
5
6
7
V
SS
N.C.
D.N.C.
WSCLK(INC)
CS
GND
V
DD
MAX5483
MAX5484
L
N.C.
N.C.N.C.
SPI/UD
DIN(U/D)
TSSOP
+
+
Pin Configurations (continued)
Ordering Information (continued)
PART PIN-PACKAGE TOP MARK
MAX5482ETE+ 16 TQFN-EP* ACQ
MAX5482EUD+ 14 TSSOP
MAX5483ETE+ 16 TQFN-EP* ACR
MAX5483EUD+ 14 TSSOP
MAX5484ETE+ 16 TQFN-EP* ACS
MAX5484EUD+ 14 TSSOP
Note: All devices are specified over the -40°C to +85°C operating
temperature range.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 TQFN-EP T1633F+3
21-0136
90-0033
14 TSSOP U14+1
21-0066 90-0113
MAX5481–MAX5484
19
Maxim Integrated