Datasheet

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 [phone]
© 1996 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
MX7575/MX7576
CMOS, µP-Compatible, 5µs/10µs, 8-Bit ADCs
_Ordering Information (continued)
__________________________________________________________Chip Topographies
____Pin Configurations (continued)
PART
MX7575JEWN
MX7575KEWN
MX7575JEQP -40°C to +85°C
-40°C to +85°C
-40°C to +85°C
TEMP. RANGE PIN-PACKAGE
18 Wide SO
18 Wide SO
20 PLCC
MX7575KEQP -40°C to +85°C 20 PLCC
MX7575SQ -55°C to +125°C 18 CERDIP**
MX7575TQ -55°C to +125°C 18 CERDIP**
INL
(LSB)
±1
±1/2
±1
±1/2
±1
±1/2
3
2 1
20 19
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
MX7575
MX7576
PLCC
TOP VIEW
AIN
AGND
D0 (LSB)
D1
D2
TP (MODE)
BUSY
CLK
D7 (MSB)
D6
D5
DGND
N.C.
D4 D3
RD CS N.C. V
DD

REF
( ) ARE FOR MX7576 ONLY. 
MX7576JN
MX7576KN
MX7576JCWN 0°C to +70°C
0°C to +70°C
0°C to +70°C 18 Plastic DIP
18 Plastic DIP
18 Wide SO
MX7576KCWN 0°C to +70°C 18 Wide SO
MX7576JP 0°C to +70°C 20 PLCC
MX7576KP 0°C to +70°C 20 PLCC
±1
±1/2
±1
±1/2
±1
±1/2
MX7576J/D 0°C to +70°C Dice* ±1
MX7576AQ -25°C to +85°C 18 CERDIP**
MX7576BQ -25°C to +85°C 18 CERDIP**
±1
±1/2
MX7576JEWN
MX7576KEWN
MX7576JEQP -40°C to +85°C
-40°C to +85°C
-40°C to +85°C 18 Wide SO
18 Wide SO
20 PLCC
MX7576KEQP -40°C to +85°C 20 PLCC
MX7576SQ -55°C to +125°C 18 CERDIP**
MX7576TQ -55°C to +125°C 18 CERDIP**
±1
±1/2
±1
±1/2
±1
±1/2
* Contact factory for dice specifications.
** Contact factory for availability.
0.081"
(2.057mm)
0.130"
(3.302mm)
D2 D1
D6
*The two AGND pads must both be used (bonded together).

TRANSISTOR COUNT: 768
SUBSTRATE CONNECTED TO V
DD
MX7575
D7

CLK
BUSY
N.C.
D0 AGND* AGND*
AIN
DGND
D5
TP
RD
CS
V
DD
REF
D4
D3
0.081"
(2.057mm)
0.130"
(3.302mm)
D2 D1
D6
*The two AGND pads must both be used (bonded together).

TRANSISTOR COUNT: 768
SUBSTRATE CONNECTED TO V
DD
MX7576

D7
(MSB)
CLK
BUSY
MODE
D0
(LSB)
AGND* AGND*
AIN
DGND
D5
N.C.
RD
CS
V
DD
REF
D4
D3
