Datasheet

MAX9996
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
COMPONENT VALUE DESCRIPTION
L1, L2 470nH Wire-wound high-Q inductors (0805)
L3 10nH Wire-wound high-Q inductor (0603)
C1 4pF Microwave capacitor (0603)
C4 10pF Microwave capacitor (0603)
C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603)
C3, C5, C9, C11 0.01µF Microwave capacitors (0603)
C13, C14 150pF Microwave capacitors (0603)
C15 150pF Microwave capacitor (0402)
R1 806Ω±1% resistor (0603)
R2 549Ω±1% resistor (0603)
R3 7.15Ω±1% resistor (1206)
T1 4:1 balun IF balun
U1 MAX9996 Maxim IC
Table 1. Component List Referring to the Typical Application Circuit
Pin Configuration/Functional Diagram
MAX9996
1
2
3
4
5
15
14
13
12
11
6
7
8910
20
19
18
17
16
GND
LOSEL
LOBIAS
TAP
RF
V
CC
V
CC
V
CC
V
CC
GND
GND
LO2
GND LEXT IFBIAS IF- IF+
GND
LO1
GND