Datasheet
AISG Integrated Transceiver
MAX9947
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND .............................................................-0.3V to +6V
V
L
to GND ...............................................................-0.3V to +6V
TXOUT, BIAS to GND ............................... -0.3V to (V
CC
+ 0.3V)
RXIN, XTAL1, XTAL2, SYNCOUT, RES to GND ......-0.3V to +6V
TXIN, RXOUT, DIR, DIRMD1,
DIRMD2 to GND ...................................... -0.3V to (V
L
+ 0.3V)
Output Short-Circuit Current TXOUT,
SYNCOUT to V
CC
or GND ....................................Continuous
All Other Pins Max In/Out Current ................................... ±20mA
Continuous Power Dissipation (T
A
= +70°C)
16-Pin TQFN (derate 17.5mW/°C) .............................1399mW
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
ELECTRICAL CHARACTERISTICS
(V
CC
= 5V, V
L
= 3.3V, TXOUT connected with 50I to RXIN, 4.1kI resistor between BIAS and RES, 10kI resistor between RES and
GND, 1kI resistor between SYNCOUT and V
CC
, T
A
= T
MIN
to T
MAX
, unless otherwise specified. XTAL frequency 8.704MHz ±30ppm.
Typical values are at T
A
= +25°C.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
TQFN
Junction-to-Ambient Thermal Resistance (q
JA
) .......57.2°C/W
Junction-to-Case Thermal Resistance (q
JC
) ...............40°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS
DC CHARACTERISTICS
Supply Voltage V
CC
Guaranteed by PSRR 3.0 5.5 V
Supply Current I
CC
23 35 mA
Logic Supply Voltage V
L
Guaranteed by logic supply current 1.6 5.5 V
Logic Supply Current I
L
V
TXIN
= 3.3V 138 380
FA
Receiver Power-Supply
Rejection Ratio
PSRR
3.0V P V
CC
P 5.5V, V
TXIN
= 3.3V
(Note 3)
49 60 dB
Output Power-Supply
Rejection Ratio
3.0V P V
CC
P 5.5V, V
TXIN
= 0V
(Note 4)
49 60 dB
LOGIC INPUTS AND OUTPUTS
Logic-Input High Threshold
Voltage
V
IH
DIRMD1, DIRMD2, TXIN 0.7 x V
L
V
Logic-Input Low Threshold
Voltage
V
IL
DIRMD1, DIRMD2, TXIN 0.3 x V
L
V
Logic-Output High Threshold
Voltage
V
OH
RXOUT, DIR source 3.3mA 0.9 x V
L
V
Logic-Output Low Threshold
Voltage
V
OL
RXOUT, DIR sink 3.3mA 0.1 x V
L
V
Input Leakage Current I
IH
, I
IL
TXIN shorted to GND or V
L
Q1
FA
DIRMD1, DIRMD2
Shorted to GND +60
Shorted to V
L
-1
SYNC INPUT (XTAL1) AND OUTPUT (SYNCOUT)
Input High Threshold Voltage V
XTAL1_IH
0.7 x
V
CC
V