Datasheet

MAX9934
High-Precision, Low-Voltage, Current-Sense Amplifier
with Current Output and Chip Select for Multiplexing
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= 3.3V, V
RS+
= V
RS-
= 3.0V, V
SENSE
= 0V, V
CM
= (V
RS+
+ V
RS-
)/2, V
CS
= 3.3V, R
OUT
= 10kΩ to GND for unidirectional opera-
tion, R
OUT
= 10kΩ to V
CC
/2 for bidirectional operation. T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
=
+25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
RS+, RS- to GND......................................................-0.3V to +6V
V
CC
to GND..............................................................-0.3V to +4V
CS, OUT to GND (V
CC
= 0, or CS < V
IL
)..................-0.3V to +4V
OUT to GND (CS > V
IH
)................................-0.3V to V
CC
+ 0.3V
Differential Input Voltage (RS+ - RS-) ....................................±6V
Output Short-Circuit Current Duration
OUT to GND or V
CC
...............................................Continuous
Continuous Input Current into Any Terminal.....................±20mA
Continuous Power Dissipation (T
A
= +70°C)
8-Pin µMAX (derate multilayer 4.8mW/°C
above +70°C).............................................................388mW
Junction-to-Ambient Thermal Resistance (θ
JA
)
(Note 1) ....................................................................206°C/W
Junction-to-Case Thermal Resistance (θ
JC
)
(Note 1) ......................................................................42°C/W
6-Bump UCSP (derate multilayer 3.9mW/°C
above +70°C).............................................................308mW
Junction-to-Ambient Thermal Resistance (θ
JA
)
(Note 1) ....................................................................260°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (µMAX only, soldering, 10s) ..............+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
T
A
= +25°C ±10
MAX9934T
-40°C ≤ T
A
≤ +125°C ±14
T
A
= +25°C ±10
Input Offset Voltage (Note 3) V
OS
MAX9934F
-40°C ≤ T
A
≤ +125°C ±20
µV
MAX9934T ±60
Input Offset Voltage Drift (Note 3) V
OS
/dT
MAX9934F ±90
nV/°C
Common-Mode Input Voltage
Range (Average of V
RS+
and
V
RS-
) (Note 3)
CMVR Guaranteed by CMRR2 -0.1 +5.5 V
T
A
= +25°C 128 134
0 ≤ V
CM
≤ V
CC
-
0.2V (MAX9934F)
-40°C ≤ T
A
≤ +125°C 112
T
A
= +25°C 128 135
CMRR1
0 ≤ V
CM
≤ V
CC
-
0.2V (MAX9934T)
-40°C ≤ T
A
≤ +125°C 109
T
A
= +25°C 119 125
-0.1 ≤ V
CM
≤ 5.5V
(MAX9934F)
-40°C ≤ T
A
≤ +125°C 104
T
A
= +25°C 98 113
Common-Mode Rejection Ratio
(Note 3)
CMRR2
-0.1 ≤ V
CM
≤ 5.5V
(MAX9934T)
-40°C ≤ T
A
≤ +125°C 98
dB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.