Datasheet

MAX9918/MAX9919/MAX9920
-20V to +75V Input Range, Precision
Uni-/Bidirectional, Current-Sense Amplifiers
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= 5V, V
RS+
= V
RS-
= +14V, V
SENSE
= (V
RS+
- V
RS-
) = 0V, V
SHDN
= V
GND
= 0V, V
REFIN
= V
CC
/2, R
L
= 100kΩ; for MAX9918, A
V
=
90V/V, R2/R1 = 89kΩ/1kΩ; for MAX9920, A
V
= 20V/V, R2/R1 = 79kΩ/1kΩ; T
A
= -40°C to +125°C, unless otherwise noted. Typical val-
ues are at T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND..............................................................-0.3V to +6V
RS+, RS- to GND (V
CC
= 5V) ..................................-30V to +80V
RS+, RS- to GND (V
CC
= 0V) .............-15V to +80V (15 minutes)
Differential Input Voltage (V
RS+
- V
RS-
)
(MAX9918/MAX9919).................................±15V (Continuous)
Differential Input Voltage
(V
RS+
- V
RS-
) (MAX9920) .............................±5V (Continuous)
REFIN, FB, OUT to GND.............................-0.3V to (V
CC
+ 0.3V)
SHDN to GND.........................................................-0.3V to +20V
Output Short Circuit to V
CC
or GND...........................Continuous
Continuous Current into Any Pin
(Not to exceed package power dissipation) ................±20mA
Continuous Power Dissipation (T
A
= +70°C)
8-Pin SO-EP (derate 24.4mW/°C above +70°C).....1951.2mW**
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SO-EP
Junction-to-Ambient Thermal Resistance (θ
JA
) ...........41°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
T
A
= +25°C ±0.14 ±0.4
V
RS+
= V
RS-
=
+14V, V
REFIN
= 0V
T
A
= -40°C
to +125°C
±0.7
T
A
= +25°C ±0.08 ±0.4
MAX9918
V
RS+
= V
RS-
=
-2V, V
REFIN
=
0V
T
A
= -40°C
to +125°C
±1.3
T
A
= +25°C ±0.18 ±0.4
V
RS+
= V
RS-
=
+14V, V
REFIN
= 0V
T
A
= -40°C
to +125°C
±0.9
T
A
= +25°C ±0.11 ±0.4
MAX9919_
V
RS+
= V
RS-
=
-2V, V
REFIN
=
0V
T
A
= -40°C
to +125°C
±1.0
T
A
= +25°C ±0.48 ±1.2
V
RS+
= V
RS-
=
+14V, V
REFIN
= 0V
T
A
= -40°C
to +125°C
±3.0
T
A
= +25°C ±0.10 ±0.9
Input Offset Voltage (Note 2) V
OS
MAX9920
V
RS+
= V
RS-
=
-2V, V
REFIN
=
0V
T
A
= -40°C
to +125°C
±3.5
mV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
**
As per JEDEC51 Standard (multilayer board).