Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
5 SC70 X5+1 21-0076 90-0188
6 SC70 X6SN+1 21-0077 90-0189
8 SOT23 K8+5 21-0078 90-0176
10 μMAX U10+2 21-0061 90-0330
V
DD
8
OUTB7
INB-6
INB+
5
1OUTA
INA+
3
INA-
2
V
SS
4
V
SS
OUTIN-
1 5 V
DD
IN+
MAX9914
SC70
TOP VIEW
2
3 4
V
SS
OUTIN-
1
+
+
6 V
DD
IN+
MAX9915
SC70
2
3 4
SHDN5
SHDN
MAX9916
SOT23
V
DD
10
OUTB9
INB-8
SHDNB
6
INB+
7
1OUTA
2INA-
V
SS
4
INA+
3
SHDNA
5
MAX9917
µMAX
SHDNA
SHDNB
+
+
MAX9914–MAX9917 1MHz, 20μA, Rail-to-Rail
I/O Op Amps with Shutdown
www.maximintegrated.com
Maxim Integrated │ 11
Pin Congurations
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS