Datasheet

MAX9892
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape-carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, refer to Application
Note 1891:
Understanding the Basics of the Wafer-
Level Chip-Scale Package (WL-CSP)
at www.maxim-
ic.com/ucsp. See Figure 4 for the recommended
MAX9892 PCB footprint.
Shunt Mode Audio Click-and-Pop Eliminator
6 _______________________________________________________________________________________
V
DD
GND
HEADPHONE
AMP V
DD
0.1μF
R
1
R
2
MAX9892
Figure 3. Scaling Down the Supply Voltage with a Voltage
Divider
250μm
45±5μm
Figure 4. PCB Footprint Recommendation Diagram
Chip Information
PROCESS: BiCMOS