Datasheet

MAX9880A
Low-Power, High-Performance
Dual I
2
S Stereo Audio Codec
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
AVDD
= V
PVDD
= V
MICVDD
= V
DVDD
= V
DVDDS1
= +1.8V, R
L
= ∞, headphone load (R
L
) connected between _OUTP and _OUTN, dif-
ferential modes, C
REF
= 2.2µF, C
MICBIAS
= C
PREG
= C
REG
= 1µF, AV
PRE
= +20dB, AV
PGAM
= 0dB, AV
DAC
= 0dB, AV
LINE
= +20dB,
AV
VOL
= 0dB, AV
LO
= 0dB, f
MCLK
= 13MHz, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages with respect to AGND.)
DVDD, AVDD, PVDD ................................................-0.3V to +2V
DVDDS1, JACKSNS, MICVDD ..............................-0.3V to +3.6V
DGND, PGND........................................................-0.1V to +0.1V
PREG, REF, REG ....................................-0.3V to (V
AVDD
+ 0.3V)
MICBIAS .............................................-0.3V to (V
MICVDD
+ 0.3V)
MCLK, LRCLKS1, BCLKS1,
SDINS1, SDOUTS1..........................-0.3V to (V
DVDDS1
+ 0.3V)
X1, X2, LRCLKS2, BCLKS2, SDINS2,
SDOUTS2, DOUT, MODE ...................-0.3V to (V
DVDD
+ 0.3V)
SDA/DIN, SCL/SCLK, CS, IRQ ..............................-0.3V to +3.6V
LOUTP, LOUTN, ROUTP, ROUTN,
LOUTL, LOUTR ....................(V
PGND
- 0.3V) to (V
PVDD
+ 0.3V)
LINL, LINR, MICLP/DIGMICDATA,
MICLN/DIGMICCLK, MICRP/SPDMDATA,
MICRN/SPDMCLK ...............................-0.3V to (V
AVDD
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
48-Bump WLP (derate 12.5mW/°C above +70°C) .....1000mW
48-Pin TQFN (derate 37mW/°C above +70°C) ..........2963mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PVDD, DVDD, AVDD 1.65 1.8 1.95
Supply Voltage Range
DVDDS1, MICVDD 1.65 1.8 3.6
V
Analog (AVDD + PVDD +
MICVDD)
5.33 8
Full-duplex 8kHz
mono (Note 3)
Digital (DVDD + DVDDS1) 1.4 2
Analog (AVDD + PVDD +
MICVDD)
3.5 6
DAC playback
48kHz stereo
(Note 3)
Digital (DVDD + DVDDS1) 2.5 4
Analog (AVDD + PVDD +
MICVDD)
8.4 12
Full-duplex 48kHz
stereo (Note 3)
Digital (DVDD + DVDDS1) 3.0 5
Analog (AVDD + PVDD +
MICVDD)
4.9 8
Total Supply Current I
VDD
Stereo line-in to
line-out only,
T
A
= +25°C
Digital (DVDD + DVDDS1) 0.012 0.05
mA
Analog (AVDD + PVDD +
MICVDD)
0.3 2
Shutdown Supply
Current
T
A
= +25°C
Digital (DVDD + DVDDS1) 2.6 8
µA
Shutdown to Full
Operation
Excludes PLL lock time 10 ms
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)...............27°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................1°C/W
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)................42°C/W
Junction-to-Case Thermal Resistance (θ
JC
).......................5°C/W