Datasheet

MAX9860
16-Bit Mono Audio Voice Codec
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
AVDD
= V
DVDD
= V
DVDDIO
= +1.8V, R
L
= ∞, headphone load (R
L
) connected between OUTP and OUTN, C
REF
= 2.2µF, C
MICBIAS
=
C
PREG
= C
REG
= 1µF, A
VPRE
= +20dB, A
VMICPGA
= 0dB, f
MCLK
= 13MHz, f
LRCLK
= 8kHz, T
A
= T
MIN
to T
MAX
, unless otherwise noted.
Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
DVDDIO, SDA, SCL, IRQ.......................................-0.3V to +3.6V
AVDD, DVDD............................................................-0.3V to +2V
AGND, DGND, MICGND .......................................-0.3V to +0.3V
OUTP, OUTN, PREG, REF, MICBIAS .....-0.3V to (V
AVDD
+ 0.3V)
MICLP, MICLN, MICRP, MICRN, REG....-0.3V to (V
PREG
+ 0.3V)
MCLK, LRCLK, BCLK,
SDOUT, SDIN..................................-0.3V to (V
DVDDIO
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C,
multilayer board) ......................................................2222mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AVDD (inferred from HP output PSRR) 1.7 1.8 1.9
DVDD (inferred from codec performance
tests)
1.7 1.8 1.9
Supply Voltage Range
DVDDIO 1.7 1.8 3.6
V
AVDD 1.46 2.2
DAC playback mode
(48kHz)
DVDD 1.05 1.6
AVDD 4.08 5.7
Full operation
8kHz mono ADC + DAC
DVDD 0.78 1.0
AVDD 6.17 9.0
Full operation
8kHz stereo ADC + DAC
DVDD 0.8 1.2
AVDD 5.38 8.0
Total Supply Current
(Note 3)
I
AVDD+DVDD
Stereo ADC only (48kHz)
DVDD 1.68 2.2
mA
AVDD 0.56 5
Shutdown Supply Current I
SHDN
T
A
= +25°C
DVDD +
DVDDIO
1.65 5
µA
Shutdown to Full Operation 10 ms
DAC (Note 4)
Gain Error ±1 ±5 %
Dynamic Range (Note 5) DR
+ 0d B vol um e setti ng , f
S
= 8kH z, m easur ed
at headphone output, T
A
= +25°C
84 90 dB
DAC Full-Scale Output 1V
RMS
f
S
= 8kHz 1.2
DAC Path Phase Delay
f = 1kHz, 0dBFS, HP
filter disabled, digital
input to analog output
f
S
= 16kHz 0.59
ms
Total Harmonic Distortion + Noise THD+N
f = 1kHz, f
MCLK
= 12.288MHz,
f
LRCLK
= 48kHz
-87 dB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)...............36°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................3°C/W