Datasheet

Stereo, High-Power, Class D Amplifiers
MAX98400A/MAX98400B
4
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PVDD to PGND ......................................................-0.3V to +30V
V
S
to GND ...............................................................-0.3V to +6V
SHDN, MONO to GND ............................................-0.3V to +6V
IN_ to GND ..............................................................-0.3V to +6V
G1, G2, RELEASE, TEMPLOCK,
LIM_TH to GND ........................................ -0.3V to (V
S
+ 0.3V)
OUT_ to PGND ......................................-0.3V to (V
PVDD
+ 0.3V)
PGND to GND ......................................................-0.3V to +0.3V
Continuous Current into OUT_ .......................................... +2.4A
Continuous Current into PVDD, PGND ............................. +4.8A
Continuous Current into All Other Pins ........................... +10mA
Duration of OUT_ Short Circuit to PVDD or PGND ...Continuous
Duration of Short Circuit Between
OUT_+ and OUT_- .................................................Continuous
Continuous Power Dissipation (T
A
= +70NC)
36-Pin TQFN Multilayer Board
(derate 35.7mW/NC above +70NC) .........................2857.1mW
B
JA
(Note 1) .............................................................28NC/W
B
JC
(Note 1) ...............................................................1NC/W
24-Pin TQFN Multilayer Board
(derate 27.8mW/NC above +70NC) .............................35.7mW
B
JA
(Note 1) .............................................................36NC/W
B
JC
(Note 1) ...............................................................3NC/W
Junction Temperature .....................................................+150NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
PVDD
= 18V, C
IN
= 1FF, V
SHDN
= 5V, LIM_TH = V
S
, TEMPLOCK = unconnected; G1 = GND, G2 = open (gain = 20.1dB), C
REL
= 1FF, C1 = C2 = 1FF, R
L
= J, AC measurement bandwidth 20Hz to 20kHz, differential input signal, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AMPLIFIER DC CHARACTERISTICS
PVDD Supply Voltage Range V
PVDD
Inferred from PVDD_PSRR 8 28 V
V
S
Supply Input Voltage V
S
Inferred from I
VS
test 4.75 5.5 V
Quiescent Current
I
PVDD
Dual-supply mode:
V
S
= 4.75V, T
A
= +25NC
10 15
mA
I
VS
6 8.2
Single-Supply
Quiescent Current
I
PVDD
Single-supply mode:
T
A
= +25NC
16 23
mA
R
L
= 8I (Note 3)
17
Shutdown Current
I
SHDN_PVDD
V
SHDN
= 0V, T
A
= +25NC,
V
S
= 5.5V
8 20
FA
I
SHDN_VS
3 10
PVDD Undervoltage Lockout V
UVLO
7 7.9 V
V
S
Regulator Output Voltage V
S
4.2 4.47 4.75 V
INPUT STAGE
Differential Input Voltage Range 2 V
RMS
Single-Ended Input Voltage
Range
1 V
RMS
Common-Mode Rejection Ratio CMRR 60 dB
Input Resistance Differential V
LIM_TH
= 0V, gain = +35dB 20 32
kI