Datasheet

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MAX98307/MAX98308
3.3W Mono Class DG Multilevel Audio Amplifier
PVDD to GND .......................................................... -0.3V to +6V
PGND to GND ..................................................... -0.3V to +0.3V
C1N to GND .......................................... (V
PVSS
- 0.3V) to +0.3V
IN+, IN- (MAX98307) ................................ -0.3V to (V
CC
+ 0.3V)
V
CC
to PVDD (MAX98307) .................................. -0.3V to +0.3V
PVSS to SVSS (MAX97307) ..................................-0.3V to +0.3V
PVSS, SVSS to GND (MAX98307) ...........................-6V to +0.3V
IN+, IN- (MAX98308) ...............................................-0.3V to +6V
PVSS to GND (MAX98308) .....................................-6V to +0.3V
All Other Pins to GND ...........................-0.3V to (V
PVDD
+ 0.3V)
Continuous Current Into/Out of PVDD, V
CC
, PGND, GND,
OUT+, OUT-, C1P, C1N, PVSS, SVSS ...................... Q800mA
Continuous Current (all other pins) ................................. Q20mA
Duration of OUT+/OUT- Short Circuit to PGND
or PVDD .................................................................Continuous
Short-Circuit Duration Between
OUT+ and OUT- Pins ............................................Continuous
Continuous Power Dissipation (T
A
= +70NC) for Multilayer Board
TQFN (derate 20.8mW/NC above +70NC)..................1667mW
WLP (derate 13.7mW/NC above +70NC)....................1100mW
Junction Temperature .....................................................+150NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) (TQFN-EP) ............ +300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
V
PVDD
= V
CC
= V
SHDN
= 3.6V, V
PGND
= V
GND
= 0V, Z
L
= 8I + 68FH between OUT+ and OUT-, (MAX98307 R
IN+
= R
IN-
= 10kI,
R
FB+
= R
FB-
= 20kI), C
IN+
= C
IN-
= 0.33FF, A
V
= 14.5dB, AC measurement bandwidth 20Hz to 20kHz, T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25NC.) (Notes 2, 3)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........48NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............10NC/W
WLP
Junction-to-Ambient Thermal Resistance (B
JA
) ..........73NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............30NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Range V
PVDD
, V
CC
Guaranteed by PSRR test 2.6 5.25 V
Quiescent Current I
DD
V
PVDD
= 3.6V 1.85 2.7 mA
Shutdown Current I
SHDN
SHDN = GND
0.225 10 µA
Power-Supply Rejection Ratio
(Note 4)
PSRR
V
PVDD
= 2.6V to 5.25V 78
dBf = 217Hz, 200mV
P-P
ripple 78
f = 10kHz, 200mV
P-P
ripple 67
Turn-On Time t
ON
Time from
shutdown or
power-on to full
operation
MAX98308 25 40
ms
MAX98307,
R
IN
= 10kI
50 80
Input DC Bias Voltage V
BIAS
1.3 V
Input Resistance (MAX98308) R
IN
A
V
= 20.5dB (maximum gain) 15 22
kI
A
V
= 17.5dB 22
A
V
= 14.5dB 22
A
V
= 11.5dB 28
A
V
= 8.5dB 40