Datasheet

2 ______________________________________________________________________________________
MAX98306
Stereo 3.7W Class D Amplifier
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Voltage
PVDD to PGND ....................................................-0.3V to +6V
OUTL+, OUTR+, OUTL-, OUTR-
to PGND ...........................................-0.3V to (V
PVDD
+ 0.3V)
All Other Pins to PGND .......................................-0.3V to +6V
Current
Continuous Current Into/Out of PVDD, PGND,
OUTL+, OUTR+, OUTL-, OUTR- .............................. ±800mA
Continuous Input Current (all other pins) .................... ±20mA
Duration of Short Circuit
OUTL+, OUTR+, OUTL-, OUTR- to PGND or PVDD ....Continuous
OUTL+ to OUTL- or OUTR+ to OUTR- ...................Continuous
Continuous Power Dissipation for a MultiLayer Board (T
A
= +70°C)
TDFN (deration 24.4mW/°C above +70°C) ...............1951.2mW
Junction Temperature ....................................................+150°C
Operating Temperature Range ......................... -40°C to +85°C
Storage Temperature Range .......................... -65°C to +150°C
Lead Temperature (10s, soldering) ...............................+300°C
Soldering Temperature (reflow) ......................................+260°C
ELECTRICAL CHARACTERISTICS
(V
PVDD
= V
SHDN
= 3.7V, V
PGND
= 0V, A
V
= 12dB (GAIN = PVDD), R
L
= J, R
L
connected between OUT_+ to OUT_-, 20Hz to 22kHz
AC measurement bandwidth, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (q
JA
) ..............41°C/W
Junction-to-Case Thermal Resistance (q
JA
) .....................8°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
GENERAL
Supply Voltage Range V
PVDD
Guaranteed by PSRR test 2.6 5.5 V
Undervoltage Lockout UVLO 1.8 2.3 V
Quiescent Supply Current I
PVDD
V
PVDD
= 3.7V 2 2.7
mA
V
PVDD
= 5.0V 2.6
Shutdown Supply Current I
SHDN
V
SHDN
= 0, T
A
= +25NC < 1 10 FA
Turn On Time t
ON
3.2 10 ms
Bias Voltage V
BIAS
1.62 V
PVDD
/2 2.15 V
Voltage Gain A
V
GAIN = PGND 17.5 18 18.5
dB
GAIN = 100kI to PGND 14.5 15 15.5
GAIN = PVDD 11.5 12 12.5
GAIN = 100kI to PVDD 8.5 9 9.5
GAIN = unconnected 5.5 6 6.5
Channel-to-Channel Gain
Tracking
0.1 %
Input Resistance R
IN
A
V
= 18dB (GAIN = PGND) 22 33
kI
A
V
= 15Db (GAIN = 100kI to PGND) 31 46
A
V
= 12dB (GAIN = PVDD) 44 65
A
V
= 9dB (GAIN = 100kI to PVDD) 62 93
A
V
= 6dB (GAIN = unconnected) 89 131
Common-Mode Rejection Ratio CMRR f
IN
= 1kHz, input referred 79 dB
Output Offset Voltage V
OS
T
A
= +25NC (Note 3) ±1 ±3 mV